Simulation study on creep deformation of the impeller in lead-bismuth eutectic environment through fluid-solid coupling method. [PDF]
Gu C +6 more
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The impact of tube bundle layout on the thermal and fluidic behaviour of liquid lead-bismuth eutectic in a helical-coiled once-through steam generator. [PDF]
Nuhash MM, Karim MR, Bhuiyan AA.
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Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish. [PDF]
Jeyeselan L, Mhd Noor EE.
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Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. [PDF]
Hsieh CL, Coyle RJ, Xian JW, Gourlay CM.
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Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling. [PDF]
Hsieh CL +4 more
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Microstructure, Microhardness, and Wear of a Rapidly Solidified Al-20Sn-1Cu Alloy with Bi Addition. [PDF]
Andrade VL +3 more
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Flexible Screen-Printed Gold Electrode Array on Polyimide/PET for Nickel(II) Electrochemistry and Sensing. [PDF]
Godja N +6 more
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