Results 21 to 30 of about 8,138,282 (202)
The failure of one solder joint out of the hundreds of joints in a system compromises the reliability of the electronics assembly. Thermal cycling is a result of both creep–fatigue mechanisms working together.
Mohammed Abueed +3 more
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Highlights of a EC funded project on Lead-free Materials and Assembly Development Technology
The EC has financially supported a pan-European collaboration on the development of lead-free interconnection materials and use of these materials for electronic assembly in a wide variety of industrial applications. The project started in April 2002 and
Vanfleteren, J. +3 more
core +1 more source
The Effect Of Void Formation On The Reliability Of ED-XRF Measurements In Lead-Free Reflow Soldering
In lead-free reflow soldering, the presence of voids should be taken into account. For this reason, the effect of the applied heating profiles was examined via the characterization of voids in galvanic and immersion Sn coatings. According to EU Directive
Koncz-Horváth D., Gergely G., Gácsi Z.
doaj +1 more source
The mechanical and fatigue properties of microelectronic interconnection materials are important issues in critical applications in the life of electronic assemblies.
Raed Al Athamneh +3 more
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Lead-Free Solders for Superconducting Applications [PDF]
In this paper, the low-temperature properties of some commercial Pb-free solders developed for electronics and aerospace applications were investigated for possible use as superconducting solder materials. Their properties are also compared with in-house Sn 35In 50Bi 15 solders being developed to replace the widely used Pb-Bi alloys. Of these materials,
Aksoy, C. +4 more
openaire +3 more sources
Kirigami–Origami‐Inspired Lead‐Free Piezoelectric Ceramics
Kirigami‐ and oirigami‐inspired techniques have emerged as effective strategies for material structure design; however, the use of these techniques is usually limited to soft and deformable materials.
Zehuan Wang +9 more
doaj +1 more source
Fast Lead-Free Humidity Sensor Based on Hybrid Halide Perovskite
An environmentally friendly analog of the prominent methylammonium lead halide perovskite, methylammonium bismuth bromide (MA3Bi2Br9), was prepared and investigated in the form of powder, single crystals and nanowires.
Veljko Djokić +9 more
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In this paper, the effects of CuO sintering aids on microstructure and electric properties are investigated for the non-stoichiometric (Na0.48K0.473Li0.04Sr0.007)(Nb0.883Ta0.05Sb0.06Ti0.007)O3+x mol% CuO lead free ceramics.
Cheng-Shong Hong +2 more
doaj +1 more source
The EC has financially supported a pan-European collaboration on the development of lead-free interconnection materials and use of these materials for electronic assembly in a wide variety of industrial applications. The project started in April 2002 and
Vanfleteren, J. +3 more
core +1 more source
Coaching millennial leaders: Life stage versus the times we live in [PDF]
This paper presents the findings of a study focused on the experience of coaches when coaching millennial leaders (where millennials are those people born 1980-1999). Following a hermeneutic phenomenological approach using Interpretative Phenomenological
Helen Franklin
doaj

