Results 51 to 60 of about 8,138,282 (202)
Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. [PDF]
Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out.
Oo, Cheng Ee
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Perovskite ferroelectic oxides with simultaneous highly thermal stable dielectric property and piezoelectric response are promising candidate for advanced energy, dielectric, and smart devices.
Hongfen Ji +7 more
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Self-powered sensor development is moving towards miniaturization and requires a suitable power source for its operation. The piezoelectric nanogenerator (PENG) is a potential candidate to act as a partial solution to suppress the burgeoning energy ...
Manisha Sahu +5 more
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Advancements and Prospects in Perovskite Solar Cells: From Hybrid to All-Inorganic Materials
Hybrid perovskites, materials composed of metals and organic substances in their structure, have emerged as potential materials for the new generation of photovoltaic cells due to a unique combination of optical, excitonic and electrical properties ...
Fernando Velcic Maziviero +6 more
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In electronic packaging, Sn-Zn lead-free solder has great application prospects. Sn-9Zn-xBi alloys were obtained by smelting. This paper details a systematic study of the effect of Bi on the microstructure, melting behavior, wettability, mechanical ...
Yan Zhi Peng +7 more
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Lead-free ferroelectric materials: Prospective applications
: The year of 2021 is the 100th anniversary of the first publication of ferroelectric behaviour in Rochelle salt, focussing on its piezoelectric properties.
Jing Feng Li (20259615) +3 more
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The comparative effectiveness of traditional lead aprons versus newer generation lead-free alternatives in radiation protection is a critical area of investigation in medical safety. While lead aprons have long been the standard, concerns over weight and
Sri Hari Prasath Gurumurthi +1 more
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An Introductory Overview of Various Typical Lead-Free Solders for TSV Technology
As semiconductor packaging technologies face limitations, through-silicon via (TSV) technology has emerged as a key solution to extending Moore’s law by achieving high-density, high-performance microelectronics.
Sooyong Choi +5 more
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A minimax distribution free procedure for mixed inventory model with variable lead time
In this article, both lead time and the order quantity are considered as the decision variables of a mixed inventory model. In our studies, we relax the assumption about the form of the cumulative distribution function of the lead-time demand and apply ...
歐陽良裕; Ouyang, Liang-yuh; 吳坤山;Wu, Kun-shan
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Tautomeric mixture coordination enables efficient lead-free perovskite LEDs [PDF]
Lead halide perovskite light-emitting diodes (PeLEDs) have demonstrated remarkable optoelectronic performance1-3. However, there are potential toxicity issues with lead4,5 and removing lead from the best-performing PeLEDs-without compromising their high ...
Kong, Lingmei +19 more
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