Results 201 to 210 of about 1,101,099 (365)

First‐Principles Modeling of Solid Solution Softening and Hardening Effects in Al–Mg–Zr–Si Aluminum Alloys

open access: yesAdvanced Engineering Materials, EarlyView.
The role of various alloying elements in face‐centered cubic aluminum on the barrier of a Shockley partial dislocation during its motion is presented. The study aims to understand how alloying atoms such as Mg, Si, and Zr affect the energy landscape for dislocation motion, thus influencing the solid solution hardening and softening in aluminum, which ...
Inna Plyushchay   +3 more
wiley   +1 more source

Learning to Rank Complex Biomedical Hypotheses for Accelerating Scientific Discovery. [PDF]

open access: yesProc (IEEE Int Conf Healthc Inform)
Ding J, Dahal S, Adhikari B, Jha K.
europepmc   +1 more source

Online Low-Rank Representation Learning for Joint Multi-Subspace Recovery and Clustering [PDF]

open access: green, 2017
Bo Li   +5 more
openalex   +1 more source

Advancing Wildfire‐Retardant Materials: Engineering Strategies for Direct and Indirect Suppression

open access: yesAdvanced Engineering Materials, EarlyView.
Here, the evolution, ecological impact, and performance of current fire‐retardant materials and suppression strategies are reviewed, offering an engineering perspective to address existing challenges and propose pathways for the development of more effective, scalable, and sustainable solutions to meet the demands of a changing climate. Wildfires cause
Changxin Dong   +4 more
wiley   +1 more source

Multimaterial Approach to Improve the Mechanical Properties of a Novel Modified Auxetic Reentrant Honeycomb Structure

open access: yesAdvanced Engineering Materials, EarlyView.
A multimaterial approach is introduced to improve upon auxetic structures by combining two different polymers into the same reentrant honeycomb structure via additive manufacturing. The deformation behavior as well as the resulting Poisson's ratio are thereby improved significantly.
Alexander Engel   +2 more
wiley   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

Learning low-rank latent mesoscale structures in networks. [PDF]

open access: yesNat Commun
Lyu H, Kureh YH, Vendrow J, Porter MA.
europepmc   +1 more source

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