Results 201 to 210 of about 537,079 (330)

P450 cyptide synthase MpoB catalyzes the cross-linking of the YPW motif on the precursor peptide. [PDF]

RSC Chem Biol
Khan AH, Haedar JR, Kiselov V, Romanuks V, Smits G, Donadio S, Phan CS.   +6 more
europepmc   +1 more source

The Linked Geometries of the Roman Pantheon and Hadrian’s Serapeum in Tivoli, Part II: The Serapeum [PDF]

Myat Thinzar Thinzar Aung, Robert Bork
openalex   +1 more source

Deformation Behavior of Optical Ceramic Nanomultilayers: The Role of Aperiodicity

Advanced Engineering Materials, EarlyView.
Ceramic nanomultilayers demonstrate optical and mechanical behavior tunability through aperiodicity. Within the studied systems, optically optimized coatings exhibit an average ultraviolet, visible, and near‐infrared spectral transmittance above 90%.
Danielle E. White, Wenjuan Cheng, Koushik Jagadish, Edoardo Rossi, Yu‐Tsun Shao, Andrea M. Hodge   +5 more
wiley   +1 more source

Practical Geometry in Europe linked to the Islamic tradition, the example of measurement and division: contribution to medieval mathematics

, 2008
Marc Moyon
openalex   +1 more source

Two Novel Heterometallic Chains Featuring Mn^II and Na^I Ions in Trigonal-Prismatic Geometries Alternately Linked to Octahedral Mn^IV Ions: Synthesis, Structures, and Magnetic Behavior [PDF]

, 2012
Sandip Mukherjee, Yogesh P. Patil, Partha Sarathi Mukherjee   +2 more
openalex   +1 more source

Influence of the silent chain link geometry on the link / chain guide contact

IOP Conference Series: Materials Science and Engineering, 2019
C. C. Gavrila, M. T. Lates
openaire   +2 more sources

Impact of Structural Adhesive Hybridization Strategy on the Performance of In‐Mold Electronics Devices Across Thermoforming and Injection Molding

Advanced Engineering Materials, EarlyView.
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García, Nekane Lozano‐Hernandez, Maria Lluisa Maspoch, Enric Fontdecaba   +3 more
wiley   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

Advanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke, John Wu, Alan L. Kastengren, Nikhilesh Chawla   +3 more
wiley   +1 more source

Biological detail and graph structure in network neuroscience. [PDF]

Front Netw Physiol
Papo D, Buldú JM.
europepmc   +1 more source

Programmable Reconfiguration of Hybrid 4D Chiral Metamaterials via Mechanical and Thermal Stimuli

Advanced Engineering Materials, EarlyView.
A class of hybrid chiral mechanical metamaterials is designed to achieve programmable reconfiguration through soft networks, hinges, and bilayer joints integrated with rigid units. Responsive to mechanical and thermal stimuli, these structures exhibit large volume changes, tunable deformation pathways, and both positive and negative thermal expansion ...
Yunyao Jiang, Siyao Liu, Yaning Li
wiley   +1 more source