Results 301 to 310 of about 301,025 (376)

Nanoplasmonic Biosensors: A Comprehensive Overview and Future Prospects. [PDF]

open access: yesInt J Nanomedicine
Mutalik C   +4 more
europepmc   +1 more source

Exploring Cellular Response to Re‐Entrant Surface Topographies

open access: yesAdvanced Materials Interfaces, EarlyView.
Re‐entrant microstructures with varied cap geometries and surface chemistries are used to probe the behavior of breast cancer cells. Geometry and wettability jointly influence adhesion, spreading, and proliferation. The study reveals how curvature‐driven confinement and surface material modulate mechanotransduction, offering insights for designing ...
Hoang Huy Vu   +3 more
wiley   +1 more source

X-ray lithography source

open access: green, 1991
M. A. Piestrup   +2 more
openalex   +1 more source

Multi‐Material Gradient Printing Using Meniscus‐enabled Projection Stereolithography (MAPS)

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
MAPS is a new vat‐free printing technique that utilizes programmed delivery of resin droplets with custom formulations to enable multi‐material gradient printing of 3D structures with user‐defined variations in mechanical stiffness, opacity, surface energy, cell densities, and magnetic properties. Abstract Light‐based additive manufacturing methods are
Puskal Kunwar   +10 more
wiley   +1 more source

A Microfluidic Multiplex Sorter for Strain Development

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
A new multiplex method for high‐throughput screening of yeast strains based on glucoamylase production is presented. Droplets containing single mutant yeast cells are incubated for enzyme production. A sorting platform divides mutants by their high‐ and mid‐activity levels.
Chiara Leal‐Alves   +6 more
wiley   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

Mechanically robust and self-cleanable encapsulated metalens via spin-on-glass packaging. [PDF]

open access: yesMicrosyst Nanoeng
Yang Y   +13 more
europepmc   +1 more source

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