Results 261 to 270 of about 2,106,842 (293)
Some of the next articles are maybe not open access.

Depth estimation of surface cracks on metallic components by means of lock-in thermography

Review of Scientific Instruments, 2013
In this work, a new method to characterize vertical cracks by lock-in thermography is presented. The heat transfer process induced by a modulated thermal excitation located in the vicinity of the crack is simulated using a finite element method computer package.
M, Streza   +3 more
openaire   +2 more sources

Investigation of lock-in infrared thermography for evaluation of subsurface defects size and depth

International Journal of Precision Engineering and Manufacturing, 2015
In this study, the investigation on lock-in infrared thermography was done for the detection and estimation of artificial subsurface defects size and depth in stainless steel sample. The experimental and the finite element analysis were performed at several excitation frequencies to interrogate the sample ranging from 0.182 down to 0.021 Hz.
Shrestha Ranjit, Kisoo Kang, Wontae Kim
openaire   +1 more source

FM mode-locking in monolithic semiconductor lasers

open access: yes, 2005
FM mode-locking in monolithic semiconductor lasers is investigated for the first time, using a travelling-wave laser model. The effects of phase modulation depth and non-zero alpha factor on pulse quality and pulse-width are discussed.
M G Thompson, R V Penty, I H White
exaly   +1 more source

Performance analysis of locking policies with limited wait depth

Proceedings of the 1992 ACM SIGMETRICS joint international conference on Measurement and modeling of computer systems, 1992
The performance of a transaction processing system with the standard two-phase locking (2PL) concurrency control (CC) method (with the general waiting policy upon a lock conflict) may be degraded significantly due to transaction blocking in a high lock contention environment. In the limit this effect leads to the thrashing
openaire   +1 more source

Defect Z-depth Determination in Flip-chip using lock-in thermography

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2017
This paper describes the use of Lock-In Thermography (LIT) technique to determine the defect Z-depth in flip chip. An empirical phase shift versus applied lock-in frequency plot for Flip-chip is first created by using samples with known defect Z-depth.
Wen Qiu   +4 more
openaire   +1 more source

Ultrasound lock-in thermography for advanced depth resolved defect selective imaging

Insight - Non-Destructive Testing and Condition Monitoring, 2007
Ultrasound lock-in thermography ('attenuation mapping') is a defect selective 'dark field' NDT technique with a high probability of defect detection (PoD), since only defects produce a signal while other features are suppressed. The basic contrast mechanism is the enhanced local mechanical loss turning a variably loaded defect into a heat source.
A Gleiter   +3 more
openaire   +1 more source

Video Detection System Design of Meshing Depth of Elevator’s Door Lock

Advanced Materials Research, 2012
The detection of meshing depth of elevator’s door lock is an important content in the detections of elevator safety performance. Based on machine vision and the principle of image processing, this paper established a detection system of meshing depth of elevator’s door lock, and designed a handheld instrument.
Zhi Yuan LU   +4 more
openaire   +1 more source

Open crack depth sizing by laser stimulated infrared lock-in thermography

Journal of Physics D: Applied Physics, 2014
Recent advances in infrared imaging have made active thermography an interesting non destructive technique for sub-surface defect detection. Here, we present a method for the estimation of the depth of open surface defects by infrared lock-in thermography, based on the relation between the crack depth and the Laplacian of the surface temperature ...
Y Fedala   +4 more
openaire   +1 more source

3D-VNAND Depth Measurement Using OFI Lock-In OBIRCH

International Symposium for Testing and Failure Analysis
Abstract To increase yield and cost competitiveness, FLASH memory device developed vertical stack 3D-VNAND. Furthermore, we introduced Cell over Peripheral (COP), which places peripheral circuits, which were previously located at the same level as memory cells, under the memory cells, thereby reducing the chip size and increasing the ...
Hyeongki Kim   +8 more
openaire   +1 more source

No apparent lock-in depth of the Laschamp geomagnetic excursion: Evidence from the Malan loess

Science in China Series D: Earth Sciences, 2006
The first-order chronological framework of the long-term Chinese loess/paleosol sequences was based mainly on magnetostratigraphy. However, there remain arguments on the lock-in ages of the major geomagnetic reversals. This study systematically compared the stratigraphic locations of the Laschamp excursion and Henrich events (H4 at ∼39 ka and H5 at ∼48
Rixiang Zhu   +5 more
openaire   +1 more source

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