Results 231 to 240 of about 3,500,861 (360)

Separation logic: a logic for shared mutable data structures

open access: yesProceedings 17th Annual IEEE Symposium on Logic in Computer Science, 2002
J. C. Reynolds
semanticscholar   +1 more source

Eco‐Friendly N, S Co‐Doped Graphene Quantum Dots for Sensing 3‐Nitro‐L‐Tyrosine via Dark State Formation: Evidence From Photoluminescence and Single‐Particle Spectroscopy

open access: yesAdvanced Materials Interfaces, EarlyView.
This study presents the selective optical sensing of 3‐Nitro‐L‐tyrosine (3NT), a biomarker associated with neurological and cardiovascular diseases, through the photoluminescence quenching of nitrogen and sulfur co‐doped graphene quantum dots (NS‐GQDs) obtained from garlic.
Abu Bakar Siddique   +6 more
wiley   +1 more source

Realization of inverse-design magnonic logic gates. [PDF]

open access: yesSci Adv
Zenbaa N   +8 more
europepmc   +1 more source

Soft Electromagnetic Actuator and Oscillator

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
This work presents a groundbreaking soft electromagnetic system capable of bistable actuation and self‐regulated oscillation. Using liquid metal and silicone as a compliant conductor, the actuator enables force generation, sensing, and feedback with minimal power.
Noah D. Kohls, Yi Chen Mazumdar
wiley   +1 more source

Robust direct voltage control of stand-alone DFIG wind systems using a fractional-order fuzzy logic approach. [PDF]

open access: yesSci Rep
Boucetta F   +7 more
europepmc   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging

open access: yesAdvanced Materials Technologies, EarlyView.
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek   +4 more
wiley   +1 more source

Enhancing rotary dryer efficiency: Adjusting blower speed for optimal temperature stability in coffee bean drying. [PDF]

open access: yesMethodsX
Syamsiana IN   +5 more
europepmc   +1 more source

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