Results 241 to 250 of about 3,500,861 (360)
The elements of logic: Adapted to the capacity of younger students, and designed for academies and the higher classes of common schools. [PDF]
Charles K. True
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This paper contrasts electrospinning and 3D printing for porous membrane fabrication, evaluating their evolution, cost, resolution, mechanical traits, and scalability. While 3D printing excels in material diversity and industrial adaptability, electrospinning achieves finer resolution and thermal resilience.
Eya Kacem+6 more
wiley +1 more source
Hospital at home (virtual wards): developing a logic model and dark logic model. [PDF]
Yahya F, Cooper M, Nazar H.
europepmc +1 more source
This review highlights recent advancements in 3DP techniques that incorporate emerging multifunctional SMP materials for applications in e‐electronics, soft actuators, biomedical devices, and more. Abstract Shape memory polymers (SMP) have recently gained significant attention as multifunctional materials for flexible and wearable electronics ...
Muhammad Yasir Khalid+4 more
wiley +1 more source
Design and assessment of even parity generator and checker circuits for nanoscale communication networks using quantum dots. [PDF]
Seyedi S, Abdoli H.
europepmc +1 more source
The Logic of Collective Bargaining and Arbitration
Alexander Hamilton Frey
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How to Manufacture Photonic Metamaterials
Metamaterials boast applications such as invisibility and “hyperlenses” with resolution beyond the diffraction limit, but these applications haven’t been exploited in earnest and the market for them hasn’t grown much likely because facile and economical methods for fabricating them without defect has not emerged.
Apurba Paul, Gregory Timp
wiley +1 more source
Minimal logic gates for probiotic <i>Escherichia coli</i> Nissle 1917 sensing and treatment of dual-bacteria intestinal infection. [PDF]
Li H+8 more
europepmc +1 more source
Silicon‐Integrated Next‐Generation Plasmonic Devices for Energy‐Efficient Semiconductor Applications
Silicon (Si)‐integrated plasmonics offer a pathway to next‐generation, energy‐efficient semiconductor applications. This review highlights advances using complementary metal–oxide–semiconductor (CMOS)‐compatible materials like transparent conductive oxides and novel architectures, particularly coupled hybrid plasmonic waveguides (CHPWs).
Nasir Alfaraj, Amr S. Helmy
wiley +1 more source