Results 131 to 140 of about 354,024 (279)

Ambipolar Organic–Inorganic Heterostructure Transistor Array for Integrated Visual Information Processing

Advanced Science, EarlyView.
We present an organic–inorganic heterostructure transistor array for neuromorphic computing, achieving 95.6% MNIST accuracy and 1.2 fJ per operation, with dynamic spatiotemporal encoding and precise vehicle direction detection under combined optical and electrical stimulation.
Wen‐Min Zhong, Wenbin Zhang, Yu‐Xiang Zeng, JiYu Zhao, Ziqi Jia, Loganathan Veeramuthu, Guanglong Ding, Yan Yan, Meng Zhang, Su‐Ting Han, Vellaisamy A. L. Roy, Fengyun Wang, Chi‐Ching Kuo, Ye Zhou   +13 more
wiley   +1 more source

Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation

Advanced Science, EarlyView.
Vertically aligned graphene microstrip pads (GMPs) break the traditional thermomechanical trade‐off in thermal interface materials. It simultaneously achieves an ultrahigh through‐plane thermal conductivity of 565.92 W m−1 K−1 and an ultralow compressive modulus below 115.16 kPa.
Xu Ran, Yaru Wang, Sijia Wu, Hejun Wang, Junhao Shen, Litao Sun, Xing Wu, Hengchang Bi   +7 more
wiley   +1 more source

Logical Challenges in Artificial General Intelligence

The present thesis pertains to the research area of logic for artificial intelligence (AI), and is motivated by the critical role of automated reasoning in AI, particularly by the capacity of automated reasoning to support logical inference, problem-solving, and explainable decision-making. Automated reasoning serves as a fundamental building block of
openaire   +2 more sources

Memristive Physical Reservoir Computing

Advanced Science, EarlyView.
Memristors’ nonlinear dynamics and input‐dependent memory effects make them ideal candidates for high‐performance physical reservoir computing (RC). Based on their conductance modulation, memristors can be classified as electronic or optoelectronic types.
Dian Jiao, Ziyuan Wang, Jingrui Wang, Li Zhang, Xianhua Wei, Lingxiang Hu, Zongxiao Li, Athanasios V. Vasilakos, Zhizhen Ye, Fei Zhuge   +9 more
wiley   +1 more source

Terahertz Channel Modeling, Estimation and Localization in RIS‐Assisted Systems

Advanced Electronic Materials, EarlyView.
Reconfigurable intelligent surfaces have become a recent intensive research focus. Based on practical applications, channel strategies for RIS‐assisted terahertz wireless communication systems are categorized into three different types: channel modeling, channel estimation, and channel localization.
Hongjing Wang, Weipeng Wang, Xuan Cong, Shiyu Wang, Gao Li, Sen Gong, Lin Huang, Hongxin Zeng, Yaxin Zhang, Ziqiang Yang   +9 more
wiley   +1 more source

Letter Re: "Artificial intelligence-powered real-time multimodal model for predicting recurrence and survival in head and neck cancer: a multicenter, multinational study". [PDF]

ESMO Open
Li N, Liu X, Zhang S.
europepmc   +1 more source

RRAM Variability Harvesting for CIM‐Integrated TRNG

Advanced Electronic Materials, EarlyView.
This work demonstrates a compute‐in‐memory‐compatible true random number generator that harvests intrinsic cycle‐to‐cycle variability from a 1T1R RRAM array. Parallel entropy extraction enables high‐throughput bit generation without dedicated circuits. This approach achieves NIST‐compliant randomness and low per‐bit energy, offering a scalable hardware
Ankit Bende, Gokulnath Rajendran, Regina Dittmann, Anupam Chattopadhyay, Vikas Rana   +4 more
wiley   +1 more source

Utilizing artificial intelligence to assess academic exam anxiety, perceived stress, and achievement motivation among college students. [PDF]

Front Psychiatry
Hamd ZY, Mohmed ZA, Alroqaiba N, Elzagawy SM, Elsayed HAE, Lashin MM, Aldera M, Alorainy AI.   +7 more
europepmc   +1 more source

Robust and Compatible Ferroelectric Memories with Polycrystalline TiO2 Channel for 3D Integration

Advanced Electronic Materials, EarlyView.
Robust and monolithic 3D compatible ferroelectric memories are realized using the polycrystalline TiO2 channel‐based FeFET. The review covers physical mechanisms of the TiO2 channel FeFET, quantitative benchmarking, and advanced planar/vertical architectures for monolithic 3D integration based on HfO2‐TiO2 gate stack, offering a roadmap for reliable ...
Xujin Song, Chenxi Yu, Shangze Li, Dijiang Sun, Jiajia Zhang, Haotong Zhu, Xiaomin Xiao, Xionghao Qin, Xiaoyan Liu, Xing Zhang, Jinfeng Kang   +10 more
wiley   +1 more source

From Concrete to Code: A Survey of AI-Driven Transportation Infrastructure, Security, and Human Interaction. [PDF]

Sensors (Basel)
Kose NA, Kose K, Liang F.
europepmc   +1 more source