Results 221 to 230 of about 17,805,085 (289)

Unlocking Terahertz Steganography: Authentication of Hidden Images in Flexible Media

open access: yesAdvanced Materials Technologies, EarlyView.
Hidden information in multilayered devices, such as steganographic portraits, is detected and authenticated using reflection‐mode terahertz time‐domain imaging. Image reconstruction relies on a dedicated figure‐of‐merit obtained by integrating the signal intensity over the time‐window associated with the reflection from the metallic mirror backing the ...
Tiziana Ritacco   +4 more
wiley   +1 more source

A Constraint‐Based Analytical Framework for Design‐Space Analysis and Material Screening of Tubular Multilayer Dielectric Elastomer Pumps for Extracorporeal Circulatory Applications

open access: yesAdvanced Materials Technologies, EarlyView.
A constraint‐based analytical framework maps the coupled effects of material properties, structural parameters, and operating conditions in tubular dielectric elastomer pumps for extracorporeal circulatory applications. The approach defines performance boundaries through mechanical, electrical, and hydraulic constraints and identifies feasible design ...
Yan Zhang   +3 more
wiley   +1 more source

Liquid Metal Resistive Sensing Architectures for Measuring Diaphragm Strain Responses on Obstructed Surfaces

open access: yesAdvanced Materials Technologies, EarlyView.
A liquid metal‐based strain‐sensing architecture to measure the deformation of a circular diaphragm against obstructed surfaces is formulated using finite element modeling and confocal imaging to establish the mechanical framework and is utilized to control diaphragm‐induced confinement on a bead array, as validated by biomolecular loading level ...
Abdullah‐Bin Siddique   +4 more
wiley   +1 more source

Low-level wind shear induced by airport buildings: A numerical simulation study

open access: yesKSCE Journal of Civil Engineering
Feng Chen   +4 more
openaire   +1 more source

Multidimensional Heat‐Path Engineering in Thermal Interface Materials for High‐Performance Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
This review presents multidimensional heat‐path engineering for thermal interface materials, showing how internal heat transport, interfacial contact and bondline formation, and processing‐defined pathway architectures together determine bonded‐joint thermal performance.
Jinsoo Na   +7 more
wiley   +1 more source

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