Results 201 to 210 of about 205,842 (264)

Liquid Metal‐Based Stretchable Strain Sensor for Fruit Growth Monitoring

open access: yesAdvanced Materials Technologies, EarlyView.
Schematic overview of the fruit growth sensor development workflow, including sensor fabrication by injection molding, electromechanical and environmental characterization, mechanical stability testing, electronic readout integration, and outdoor field validation for monitoring of fruit growth under practical orchard conditions.
Asad Ullah   +7 more
wiley   +1 more source

Extreme‐Temperature Resistant, Flexible, and Sensitive Strain Sensor for Aerospace Parachute Deployment

open access: yesAdvanced Materials Technologies, EarlyView.
In this study, we report a resistive‐type strain sensor fabricated using single‐walled CNTs, are used layer using the pray technique to deposit as conductive, and UV‐resin was spin‐coated as a protection layer. The sensor functioned in harsh temperature variation conditions from −50°C to 125°C without deterioration.
Jagan Singh Meena   +4 more
wiley   +1 more source

Hydrogel‐Based Functional Materials: Classifications, Properties, and Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Conductive hydrogels have emerged as promising materials for smart wearable devices due to their outstanding flexibility, multifunctionality, and biocompatibility. This review systematically summarizes recent progress in their design strategies, focusing on monomer systems and conductive components, and highlights key multifunctional properties such as
Zeyu Zhang, Zao Cheng, Patrizio Raffa
wiley   +1 more source

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

open access: yesAdvanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco   +5 more
wiley   +1 more source

Adhesive Double‐Network Granular Organogel E‐Skin

open access: yesAdvanced Materials Technologies, EarlyView.
We introduce a double‐network granular organogel adhesive for electronic skin, overcoming adhesion and strength trade‐offs. It provides reversible, robust bonding and ionic conductivity, enabling wearable and soft robotic e‐skin. Thanks to the e‐skin adhesive, a soft robotic trunk can recognize touch, temperature, humidity, and acidity.
Antonia Georgopoulou   +4 more
wiley   +1 more source
Some of the next articles are maybe not open access.

Related searches:

Machine intelligence and intelligent machines

Proceedings of 2011 International Conference on Fluid Power and Mechatronics, 2011
Since the word mechatronics was created in 1960s, the connection in physical level of mechanical and electronic subsystems and power driving had been gradually realized. By the end of 1980s, it was emphasized that the control of mechatronics systems was based on sensor information, scilicet the concept of information-driven. At the turn of the century,
Sunran Wang, Hongyu Di
openaire   +1 more source

Machine intelligence

Proceedings of the SIGCHI Conference on Human Factors in Computing Systems, 2009
Under certain conditions, we appear willing to see and interact with computing machines as though they exhibited intelligence, at least an intelligence of sorts. Using examples from AI and robotics research, as well as a selection of relevant art installations and anthropological fieldwork, this paper reflects on some of our interactions with the kinds
openaire   +1 more source

Diabatization by Machine Intelligence

Journal of Chemical Theory and Computation, 2020
Understanding nonadiabatic dynamics is important for chemical and physical processes involving multiple electronic states. Direct nonadiabatic dynamics simulations are often employed to observe such processes on a femtosecond time scale. One often needs to do the simulation on a longer time scale, but direct simulation based on electronic structure ...
Yinan Shu, Donald G. Truhlar
openaire   +2 more sources

Home - About - Disclaimer - Privacy