Results 241 to 250 of about 1,937,598 (321)

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

A Simulative Evaluation of Triply Periodic Minimal Surface Structures in the Context of Elastocaloric Applications

open access: yesAdvanced Engineering Materials, EarlyView.
A simulative evaluation of triply periodic minimal surface (TPMS) structures for an elastocaloric application under compressive load is performed. For the evaluation of the structure's performance, surface/volume ratio, generated heat and invested mechanical work are taken into account and are compared to a tube as a reference specimen.
Michael Fries   +3 more
wiley   +1 more source

Electronic Control System for Optimized Resonance Operation of Dielectric Elastomer Pumps through Self‐Sensing

open access: yesAdvanced Engineering Materials, EarlyView.
A powerful electronic control system enables a dielectric elastomer pump to operate at resonance, matching conventional pump performance. Using self‐sensing to reconstruct load pressure dynamically, the adaptive control adjusts resonance frequency accordingly.
Matthias Baltes   +3 more
wiley   +1 more source

Forest Type, Bark Wounding, and Tapping: Their Combined Influence on Bacteria Biota of Styrax Paralleloneurus in Natural and Community Forest. [PDF]

open access: yesEnviron Microbiol Rep
Susilowati A   +10 more
europepmc   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

Efficient and Scalable Radiative Cooling for Photovoltaics Using Solution‐Processable and Solar‐Transparent Mesoporous Nanoparticles

open access: yesAdvanced Functional Materials, EarlyView.
Graded refractive index (GRI) structures are prepared from the layer‐by‐layer spray coating of the mesoporous SiO2 nanoparticles, showing high solar transparency and thermal emissivity. Under outdoor conditions, after 50 days, the GRI‐coated photovoltaics show on average 6.65 ± 1.48 °C lower than that of the non‐coated references, maintaining 80.9 ± 8 ...
Heesuk Jung   +14 more
wiley   +1 more source

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