Results 151 to 160 of about 29,914 (227)

<i>KDM6A</i> Variants Increased Relapse Risk in Adult Acute Myeloid Leukemia. [PDF]

open access: yesCancers (Basel)
Zhao Y   +11 more
europepmc   +1 more source

Real‐Time, Label‐Free Monitoring of Cell Behavior on a Bioelectronic Scaffold

open access: yesAdvanced Functional Materials, EarlyView.
A bioelectronic nanofibrous scaffold is introduced that supports cell growth while enabling real‐time, label‐free monitoring of cellular behavior through impedance measurements. The system correlates electrical signals with cell viability and surface coverage, offering an integrated platform for studying dynamic biological processes and advancing next ...
Dana Cohen‐Gerassi   +10 more
wiley   +1 more source

Mechanism of Penoxsulam's Effect on Chlorophyll Synthesis and the Metabolism of Foxtail Millet. [PDF]

open access: yesPlants (Basel)
Chen T   +9 more
europepmc   +1 more source

Photothermal Macroporous Lignin Cryogels for Off‐Grid, Continuous Atmospheric Water Collection via Interlayer Heat Recovery

open access: yesAdvanced Functional Materials, EarlyView.
Photothermal, macroporous lignin‐based cryogels are engineered to convert sunlight into low‐grade heat. Integrated as stacked beds in a drum‐type device, a thin copper interlayer transfers waste heat between beds, enabling interlayer heat recovery and continuous solar cycling.
Jie Yan   +8 more
wiley   +1 more source

Scalable Thermal Engineering via Femtosecond Laser‐Direct‐Written Phononic Nanostructures

open access: yesAdvanced Functional Materials, EarlyView.
This study demonstrates that femtosecond laser‐induced periodic surface structures (fs‐LIPSS) can function as phononic metasurfaces, reducing thermal conductivity below the plain thin‐film limit. Phonon Monte Carlo analysis reveals that the periodic structures restrict phonon mean free paths.
Hiroki Hamma   +4 more
wiley   +1 more source

Conductive Bonding and System Architectures for High‐Performance Flexible Electronics

open access: yesAdvanced Functional Materials, EarlyView.
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley   +1 more source

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