Results 121 to 130 of about 4,786 (133)
Some of the next articles are maybe not open access.

Broadband Monopolar Microstrip Patch Antenna With Shorting Vias and Coupled Ring

IEEE Antennas and Wireless Propagation Letters, 2014
Juhua Liu, Shao Y Zheng, Yuanxin li
exaly  

Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias

Journal of the Electrochemical Society, 2013
Thomas Moffat, Daniel Josell
exaly  

Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

Electrochimica Acta, 2013
Fumihiro Inoue   +2 more
exaly  

Design of Periodic Shorting-Vias for Suppressing the Fundamental Mode in Microstrip Leaky-Wave Antennas

IEEE Transactions on Antennas and Propagation, 2015
Juhua Liu, Yuanxin li
exaly  

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

Journal of Electronic Materials, 2012
Byoung-Joon Kim   +2 more
exaly  

Higher‐mode textile patch antenna with embroidered vias for on‐body communication

IET Microwaves, Antennas and Propagation, 2016
William G Whittow   +1 more
exaly  

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