Results 131 to 133 of about 4,786 (133)

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014
exaly  

Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias

Jom, 2011
exaly  

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

IBM Journal of Research and Development, 2008
exaly