Results 141 to 150 of about 14,184 (310)
Timing Asset Market Peaks: The Role of the Liquidity Risk Cycle of the Banking System
, 2012 Patrick Weber
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Advanced Materials Interfaces, EarlyView.Aqueous directional ice templating (DIT) is developed for making NMC811 cathodes containing vertically aligned pore arrays through electrode thickness. The effects of calendering are studied for the DIT electrodes to find optimal calendering and simultaneously achieve high gravimetric and volumetric energy densities and rate capability for lithium ion ...
Guanting Li +3 more
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Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.This review focuses on the application of synthetic biodegradable microarray patches (MAPs) in sustained drug delivery. Compared to conventional MAPs which release drugs into the skin in an immediate manner, these implantable MAPs release drugs into skin microcirculation gradually as the biodegradable polymers degrade, thus offering sustained release ...
Li Zhao +6 more
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3D Printing of Highly Electrically Conductive Zinc for Sustainable Electronics Applications
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.A 3D printable zinc ink system with active zinc particles in a shellac matrix is demonstrated. The results show high conductivity, stable performance of printed structures under varying humidity conditions, and promising application in disposable water‐activated batteries. This technology combining digital material assembly, reliable operation, and non‐
Xavier Aeby +5 more
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Advanced Materials Technologies, EarlyView.The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz +5 more
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Advanced Materials Technologies, EarlyView.Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya +2 more
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Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Advanced Materials Technologies, EarlyView.Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
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