Results 131 to 140 of about 1,720,417 (290)

Performance Aspects of Sparse Matrix-Vector Multiplication

Acta Polytechnica, 2006
Sparse matrix-vector multiplication (shortly SpM×V) is an important building block in algorithms solving sparse systems of linear equations, e.g., FEM.
I. Šimeček
doaj  

Real-Time Passive Acoustic Mapping Using Sparse Matrix Multiplication. [PDF]

IEEE Trans Ultrason Ferroelectr Freq Control, 2021
Kamimura HAS, Wu SY, Grondin J, Ji R, Aurup C, Zheng W, Heidmann M, Pouliopoulos AN, Konofagou EE.   +8 more
europepmc   +1 more source

High‐Entropy Alloy Interlayers Toward Advanced Joining for High‐Performance Structural Applications: Current Progress and Emerging Challenges

Advanced Engineering Materials, EarlyView.
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan, Jiafen Song, Jinglong Li, Jiangtao Xiong, Tao Yang   +4 more
wiley   +1 more source

SpDRAM: Efficient In-DRAM Acceleration of Sparse Matrix-Vector Multiplication

IEEE Access
We introduce novel sparsity-aware in-DRAM matrix mapping techniques and a corresponding DRAM-based acceleration framework, termed SpDRAM, which utilizes a triple row activation scheme to efficiently handle sparse matrix-vector multiplication (SpMV).
Jieui Kang, Soeun Choi, Eunjin Lee, Jaehyeong Sim   +3 more
doaj   +1 more source

Effect of Cu and CuP Additions on the Microstructure and Nanoindentation‐Based Fracture Behavior of CoNiAlSi Ferromagnetic Shape Memory Alloys

Advanced Engineering Materials, EarlyView.
Cu and combined Cu–P microalloying refine the microstructure and enhance the nanoindentation‐derived fracture resistance of CoNiAlSi ferromagnetic shape memory alloys without suppressing the martensitic transformation. Comparative SEM, DSC, and nanoindentation results reveal that the CuP‐containing alloy provides the most balanced response, achieving ...
Mehmet Demir
wiley   +1 more source

Matrix Multiplication in the MPC Model

In this paper, we present algorithms to solve matrix multiplication problems in the MPC model. In particular, we consider the problem under various processor/memory constraints in the MPC model and prove the following results. 1. Multiplication of two rectangular matrices of size $d \times n$ and $n \times d$ ( where $d \leq n$) respectively can be ...
Lakshya Joshi, Arya Deshmukh, Atharv Chhabra, Chetan Gupta   +3 more
openaire   +3 more sources

Enhancement of the Through‐Thickness Electrical Conductivity of Carbon‐Fiber‐Reinforced Plastics Using Large Graphite Particles

Advanced Engineering Materials, EarlyView.
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe, Yu Zhou, Shintaro Kamiyama, Takao Okada, Tomohiro Yokozeki, Ryoma Tokonami, Tatsuhiro Takahashi   +6 more
wiley   +1 more source

Full Precision Hardware Implementation of the AlphaEvolve 4×4 Complex Valued Matrix Multiplication Algorithm

IEEE Access
Matrix multiplication is a fundamental operation across many domains. For $4\times 4$ matrices, the naive algorithm requires 64 multiplications, while Strassen’s method reduces this to 49.
Ettore Napoli
doaj   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source

Composites of Shellac and Silver Nanowires as Flexible, Biobased, and Corrosion‐Resistant Transparent Conductive Electrodes

Advanced Functional Materials, EarlyView.
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein, Tiago Carneiro Gomes, Eliza Ng, Simon Rondeau‐Gagné, Tricia Breen Carmichael   +4 more
wiley   +1 more source