Results 191 to 200 of about 7,305,031 (247)

Enhancement of the Through‐Thickness Electrical Conductivity of Carbon‐Fiber‐Reinforced Plastics Using Large Graphite Particles

Advanced Engineering Materials, EarlyView.
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe, Yu Zhou, Shintaro Kamiyama, Takao Okada, Tomohiro Yokozeki, Ryoma Tokonami, Tatsuhiro Takahashi   +6 more
wiley   +1 more source

Quantitation of Cirtuvivint (SM08502) in Human Plasma by LC-MS/MS. [PDF]

Biomed Chromatogr
Holleran JL, Deppas JJ, Feng Y, Hochman MJ, Chen EC, Stahl M, Gore SD, Synold TW, Beumer JH, Venkataramanan R, Parise RA.   +10 more
europepmc   +1 more source

The Role of Ultra‐Thin Passive Films and Organic Adsorbates on Aluminum Chips for a Friction‐Induced Solid‐State Recycling Process

Advanced Engineering Materials, EarlyView.
Despite benefits to storage stability and handleability of aluminum scrap, octadecyl phosphonic acid (ODPA) SAMs reduce the tensile strength of wires produced using friction‐induced recycling. Etching and methyl diphosphonic acid (MDPA) coatings, however, have little effect.
Timothy D. Goller, Steffen Gabsa, Werner Homberg, Guido Grundmeier   +3 more
wiley   +1 more source

Elastic–Plastic Modeling and Experimental Characterization of Granular Jamming Actuators

Advanced Engineering Materials, EarlyView.
Granular jamming enables rapid switching between soft and rigid mechanical states. Here, a reduced‐order elastic‐perfectly‐plastic beam framework captures pressure‐dependent loading, unloading, residual deformation, and hysteresis in jammed beams, while matching three‐point bending experiments across materials and geometries. The framework links design
Saheli Patel, Prashant K. Purohit, Jordan R. Raney   +2 more
wiley   +1 more source

Electrodeposition in Structural Lattices of Variable Architectures

Advanced Engineering Materials, EarlyView.
Electrodeposition enables geometry‐sensitive, autonomous void filling while simultaneously tuning chemical and mechanical properties. The development of approaches that can autonomously fill and heal material voids and yield composites with tailorable properties is increasingly relevant in engineering.
Yeong‐Man Kwon, Jingwen Zhang, Guido Musso, Alessandro F. Rotta Loria   +3 more
wiley   +1 more source

Gyroid Structured Globugraphite Carbon Foam With Hierarchical and Tailored Pore Size

Advanced Engineering Materials, EarlyView.
Secondary sacrificial templates were designed and printed to create a defined network within a porous carbon. Lattices thermally degrades during the sintering process. Lattices are imprinted into the ceramic template and transferred to the morphology of Globugraphite.
Christiane Roller, Justin Neumann, David Ploch, Lennard M. Flohr, Julian Karsten, Fabian A. Riebesehl, Bodo Fiedler   +6 more
wiley   +1 more source

Investigation of Resonance Characteristics of More Than 10 000 Metal‐Coated Silicon MEMS Cantilevers Using Machine Learning

Advanced Engineering Materials, EarlyView.
More than 10 000 metal‐coated silicon MEMS cantilevers are fabricated and characterized to build a large‐scale experimental dataset spanning multiple vibrational modes. Machine learning algorithms are benchmarked to predict resonance frequency and quality factor, with ensemble based models achieving accuracy approaching experimental uncertainty.
Sina Zare Pakzad, Saurabh Thorat, Andre Loch Gesing, Dominik Huber, Christopher Zellner, Patrick Egger, Georg Pfusterschmied, Ulrich Schmid, Michael Schneider   +8 more
wiley   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source

Printed Integrated Logic Circuits Based on Chitosan‐Gated Organic Transistors for Future Edible Systems

Advanced Functional Materials, EarlyView.
Edible electronics needs integrated logic circuits for computation and control. This work presents a potentially edible printed chitosan‐gated transistor with a design optimized for integration in circuits. Its implementation in integrated logic gates and circuits operating at low voltage (0.7 V) is demonstrated, as well as the compatibility with an ...
Giulia Coco, Valerio Francesco Annese, Valerio Galli, Ilaria Penna, Debora Russo, Marina Veronesi, Rita Scarpelli, Stefania Sabella, Mario Caironi   +8 more
wiley   +1 more source