Results 31 to 40 of about 333,955 (198)

New Developments in the Field of Production and Application of Multi‐Material Wire Arc Additive Manufacturing Components: A Review

open access: yesAdvanced Engineering Materials, EarlyView.
The utilization of direct energy deposition (DED)‐arc additive manufacturing processes in industrial applications is increasing, and these processes have the potential for multi‐material applications. This work provides a overview of the state of research in DED‐arc made functional graded structures, to establish a link to potential industrial ...
Kai Treutler, Volker Wesling
wiley   +1 more source

A Comprehensive Review of Additive Manufacturing for Space Applications: Materials, Advances, Challenges, and Future Directions

open access: yesAdvanced Engineering Materials, EarlyView.
Additive manufacturing (AM) transforms space hardware by enabling lightweight, high‐performance, and on‐demand production. This review outlines AM processes—powder bed fusion (PBF), directed energy deposition (DED), binder jetting (BJ), sheet lamination (SL), and material extrusion (ME)—applied to propulsion, satellite structures, and thermal devices ...
Stelios K. Georgantzinos   +8 more
wiley   +1 more source

Micromechanical Insights into Sinter‐Based Additively Manufactured NiTi with Nb as a Sintering Aid

open access: yesAdvanced Engineering Materials, EarlyView.
This study investigates the microstructural and micromechanical behavior of NiTiNb made through filament‐based materials extrusion via chemically correlated nanoindentation. B19' remnants from the original powder lead to Nb gradients within NiTiNb grains due to the short sintering times required in liquid‐phase sintering.
Nerea Abando   +4 more
wiley   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

Ultrahigh Piezoelectricity in Truss‐Based Ferroelectric Ceramics Metamaterials

open access: yesAdvanced Functional Materials, Volume 35, Issue 12, March 18, 2025.
By leveraging the unique combination of polarization direction and loading state, ultrahigh piezoelectricity is achieved through careful tuning of the relative density and scaling ratio in truss‐based ferroelectric metamaterials. This approach enables the simultaneous realization of extremely high piezoelectric constants and ultralow dielectric ...
Jiahao Shi   +6 more
wiley   +1 more source

Quantum Emitters in Hexagonal Boron Nitride: Principles, Engineering and Applications

open access: yesAdvanced Functional Materials, EarlyView.
Quantum emitters in hexagonal boron nitride have emerged as a promising candidate for quantum information science. This review examines the fundamentals of these quantum emitters, including their level structures, defect engineering, and their possible chemical structures.
Thi Ngoc Anh Mai   +8 more
wiley   +1 more source

Which Chromium–Sulfur Compounds Exist as 2D Material?

open access: yesAdvanced Functional Materials, EarlyView.
2D chromium sulfides synthesized using molecular beam epitaxy on graphene. Structural characterization reveals two novel 2D materials, Cr2S3‐2D, which lacks a direct bulk counterpart, and Cr223S${\rm Cr}_{2\frac{2}{3}}{\rm S}$4‐2D, a minimum thickness version of Cr5S6. However, attempts to synthesize CrS2 are unsuccessful. Both new 2D phases are stable
Affan Safeer   +5 more
wiley   +1 more source

Engineering Strategies for 2D Layered Tin Halide Perovskite Field‐Effect Transistors

open access: yesAdvanced Functional Materials, EarlyView.
2D halide perovskites are promising candidates for field‐effect transistor (FET) applications due to their high stability and suppressed ion migration in the presence of bulky organic spacers. This review systematically summarizes the optimization engineering strategies of 2D perovskite FETs and future challenges, which provide guidance for developing ...
Shuanglong Wang   +4 more
wiley   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

open access: yesAdvanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone   +11 more
wiley   +1 more source

Prospects of Electric Field Control in Perpendicular Magnetic Tunnel Junctions and Emerging 2D Spintronics for Ultralow Energy Memory and Logic Devices

open access: yesAdvanced Functional Materials, EarlyView.
Electric control of magnetic tunnel junctions offers a path to drastically reduce the energy requirements of the device. Electric field control of magnetization can be realized in a multitude of ways. These mechanisms can be integrated into existing spintronic devices to further reduce the operational energy.
Will Echtenkamp   +7 more
wiley   +1 more source

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