Results 201 to 210 of about 1,362,857 (332)
Challenges With Implementation Of The Merit System In The Open Recruitment Of Government High Positions: The Case In Indonesia [PDF]
Septiana Dwiputrianti
openalex +1 more source
Rhode Island\u27s New Judicial Merit Selection Law [PDF]
Jenks, Barton P., III
core +1 more source
Materials exist that are useful for gamma scintillation, radiation shielding, neutron‐gamma pulse shape discrimination (PSD), thermal neutron detection, or high refractive index applications. While certain materials have exhibited optimal performance for each of these applications, none achieve multiple functions.
Isabelle Winardi +13 more
wiley +1 more source
Topological interface state-based photonic crystal sensor with porous cap layer for high-performance biosensing. [PDF]
Barvestani J.
europepmc +1 more source
In this report, we demonstrate that a crystalline phase of 52nm thick NiFe2O4 can be grown by RF sputtering on top of γ‐Al2O3(8nm)/SrTiO3 at a significantly low temperature (150 °C) without compromising the mobility and carrier density of the 2D electron gas at the γ‐Al2O3(8nm)/SrTiO3 interface.
Amit Chanda +11 more
wiley +1 more source
Dual‐Ligand Metal‐Organic Frameworks via In Situ Amidoxime Engineering for Selective Ion Separation
Inspired by microbial ion‐trapping mechanisms, a mild and universal strategy is developed to construct highly porous amidoxime‐functionalized MOFs. DFT calculations and molecular force measurements reveal that the dual‐ligand amidoxime configuration significantly strengthens Ga(III) affinity.
Zhifang Lv +9 more
wiley +1 more source
How the Merits Matter: D&O Insurance and Securities Settlements [PDF]
Tom Baker, Sean J. Griffith
openalex
Institutional Responses to State Merit Aid Programs: The Case of Florida Community Colleges
Juan Carlos Calcagno, Mariana Alfonso
openalex +1 more source
Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley +1 more source

