Results 151 to 160 of about 6,818 (266)

Universal High-Resolution Copper Patterning on Diverse Substrates via Sequential Laser-Induced Transfer and Electroless Plating. [PDF]

Micromachines (Basel)
Ji Y, Xu J, Yin W, Huang Y, Pan R, Chen Y.   +5 more
europepmc   +1 more source

Understanding the Stochastic Nature of Process Parameter Development of Blown Powder Laser Beam Directed Energy Deposition Additive Manufacturing of Pure Molybdenum

Advanced Engineering Materials, EarlyView.
Identified through the use of statistical design of experiments and metallographic investigation, this study exposes the stochastic origins of intergranular cracks in blown powder laser beam directed energy deposition additive manufacturing of pure molybdenum. It further demonstrates a successful crack mitigation approach with direct correlation to the
Nathaniel J. Lies, Daniel E. Driemeyer, Aaron P. Stebner   +2 more
wiley   +1 more source

Robust Spot Melting by 3D Spot Arrangements in Electron Beam Powder Bed Fusion

Advanced Engineering Materials, EarlyView.
This work proposes an approach to replace separately melted contours for spot melting in electron beam powder fusion. Adapting the spot arrangements close to the contour combined with stacking yields a comparable surface quality without the inherent challenges of separate contours, as demonstrated, by electron optical images and roughness measurements.
Tobias Kupfer, Lukas Spano, Sebastian Pohl, Carolin Körner, Matthias Markl   +4 more
wiley   +1 more source

Monocrystalline silicon solar cell efficiency dependence on potassium silicate additive in texturing process with a study on the effect of the active material. [PDF]

PLoS One
Abdel Naser S, Diab AAZ, Al Dawsari S, Ismeil MA, Zahran M.   +4 more
europepmc   +1 more source

Fostering Innovation: Streamlining Magnetocaloric Materials Research by Digitalization

Advanced Engineering Materials, EarlyView.
Magnetocaloric cooling (MCE) is an environmentally friendly refrigeration method with great potential. Optimizing MCE materials involves the preparation and screening of large quantities of samples, which in turn generates a large amount of data. A digitalization approach is presented that uses ontologies, knowledge graphs, and digital workflows to ...
Simon Bekemeier, Moritz Blum, Luana Caron, Alisa Chirkova, Philipp Cimiano, Basil Ell, Inga Ennen, Michael Feige, Maik Gaerner, Thomas Hilbig, Andreas Hütten, Günter Reiss, Tapas Samanta, Sonja Schöning, Christian Schröder, Lennart Schwan, Chris Taake, Martin Wortmann   +17 more
wiley   +1 more source

Development and Research of Gradient Polymer-Metal Materials Obtained Using Additive Technologies, with an Assessment of Their Functional and Mechanical Properties. [PDF]

Polymers (Basel)
Tyurina S, Karzakova V, Demin V, Zhang C, Rusinov P.   +4 more
europepmc   +1 more source

Multimodal Data‐Driven Microstructure Characterization

Advanced Engineering Materials, EarlyView.
A self‐consistent autonomous workflow for EBSP‐based microstructure segmentation by integrating PCA, GMM clustering, and cNMF with information‐theoretic parameter selection, requiring no user input. An optimal ROI size related to characteristic grain size is identified.
Qi Zhang, Santiago Benito, Özge Özgün, Sebastian Weber, Markus Stricker   +4 more
wiley   +1 more source

Observing and Suppressing Metallization in MoS₂ for Near-Ideal Spin Filtering. [PDF]

ACS Appl Mater Interfaces
Huang TC, Chen YX, Chen YL, Wu MT, Pai CF, Chuang C, Hsieh YP, Hofmann M.   +7 more
europepmc   +1 more source

Symbolic Regression and Multi‐Objective Optimization of the Flory–Huggins Interaction Parameter for Hydrogels

Advanced Engineering Materials, EarlyView.
We develop a data‐driven method to derive the mathematical expressions of the Flory–Huggins interaction parameter χ for the swelling behavior of temperature–responsive hydrogels. Starting from initial assumptions of χ, our workflow combines Bayesian optimization, Flory–Rehner theory, and symbolic regression to generate candidate χ expressions.
Yawen Wang, Adrian Ehrenhofer, Thomas Wallmersperger   +2 more
wiley   +1 more source

Ohmic Contact Resistance in Wide-Bandgap and Ultrawide-Bandgap Power Semiconductors: From Fundamental Physics to Interface Engineering. [PDF]

Materials (Basel)
Weis M.
europepmc   +1 more source