Results 21 to 30 of about 100,720 (329)

Effects of barriers on the thermal enhancement in boiling flow within a ribbed-microchannel using molecular dynamics simulation approach

open access: yesAin Shams Engineering Journal, 2023
In this work, argon flow within different microchannels with square cross-section is simulated by the molecular dynamics simulation (MDS) method. The first simulation is done within ideal microchannel and then, internal surfaces of this microchannel are ...
Wanhai Liu   +8 more
doaj   +1 more source

High performance microfluidic rectifiers for viscoelastic fluid flow [PDF]

open access: yes, 2012
The flow of Newtonian and non-Newtonian fluids within microfluidic rectifiers with a hyperbolic shape was investigated to assess the effect of the bounding walls on the diodicity of the microfluidic device and achieve high flow anisotropy.
Alves, M.A.   +3 more
core   +1 more source

Simulation of copper-water nanofluid in a microchannel in slip flow regime using the lattice Boltzmann method with heat flux boundary condition [PDF]

open access: yes, 2015
Laminar forced convection heat transfer of water–Cu nanofluids in a microchannel is studied using the double population Thermal Lattice Boltzmann method (TLBM). The entering flow is at a lower temperature compared to the microchannel walls.
D'Orazio, Annunziata   +2 more
core   +1 more source

Optofluidic microchannels in aerogel [PDF]

open access: yesOptics Letters, 2011
We report optofluidic waveguides made by filling microchannels in aerogel with water. The aerogel cladding is a nanoporous material with an extremely low refractive index of ~1.05, giving a large index step from the water core. Channels were formed by removing embedded optical fibers, which could be nonuniform or multiple.
Xiao, Limin, Birks, T.A.
openaire   +3 more sources

Nano-flow thermal sensor applying dymamic w-2w sensing method [PDF]

open access: yes, 2006
This article presents microchannel thermal flow sensors fabricated using standard micromachining technology. The sensors comprise of a SiXNY microchannel created by etching of a poly-Si sacrificial layer.
Dijkstra, M.   +3 more
core   +6 more sources

The Effects of Gravity on the Pressure Drop and Heat Transfer Characteristics of Steam in Microchannels: An Experimental Study

open access: yesEnergies, 2020
Experiments were carried out to investigate the pressure drop and heat transfer behaviors of a microchannel condenser. The effects of gravity on the condensation of steam in the microchannels were investigated for both horizontal and vertical cases.
Minhhung Doan   +2 more
doaj   +1 more source

Acoustic Streaming Efficiency in a Microfluidic Biosensor with an Integrated CMUT

open access: yesMicromachines, 2023
The effect of microchannel height on acoustic streaming velocity and capacitive micromachined ultrasound transducer (CMUT) cell damping was investigated.
Donatas Pelenis   +5 more
doaj   +1 more source

Flow characteristics and heat transfer performance in a Y-Fractal mini/microchannel heat sink [PDF]

open access: yes, 2019
This article presents a combined experimental and computational study to investigate the flow and heat transfer in a Y-fractal microchannel. Experimental apparatus was newly built to investigate the effect of three different control factors, i.e., fluid ...
Deng, Zhanfeng   +8 more
core   +2 more sources

Research of Characteristics of Gas-liquid Two-phase Pressure Drop in Microreactor

open access: yesMATEC Web of Conferences, 2015
With the research system of nitrogen and deionized water, this paper researches the pressure drop of gas-liquid two-phase flow in the circular microchannel with an inner diameter which is respectively 0.9mm and 0.5mm, analyzes the effect of microchannel ...
Li Dan
doaj   +1 more source

Optimization of Dimples in Microchannel Heat Sink with Impinging Jets—Part B: the Influences of Dimple Height and Arrangement [PDF]

open access: yes, 2018
The combination of a microchannel heat sink with impinging jets and dimples (MHSIJD) can effectively improve the flow and heat transfer performance on the cooling surface of electronic devices with very high heat fluxes.
Cai, C   +5 more
core   +1 more source

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