Results 51 to 60 of about 2,015 (231)
Microchannel Heat Sink Based on Boiling Heat Transfer.
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B, 1995 Development of a heat sink for future integrated circuit chips has been achieved on the basis of boiling heat transfer in a vertical microchannel. The microchannel was manufactured on a 1.5 mm-thick copper plate by electric discharge machining. The performance of the three kinds of micro-channel heat sinks of which cross sections were 2, 4, and 16 mm ...
Takahashi, Ichiro, Ishikawa, Eisuke
openaire +2 more sources
Heat Transfer, EarlyView.ABSTRACT Compact plate‐fin heat exchangers (PFHEs) are commonly utilized in diverse industries, including aerospace, automotive, processing, and space. Various fin configurations, such as Plain fins, Wavy fins, Lance and Offset fins (OSFs), Perforated fins, louvered fins, and pin fins, are employed in compact heat exchangers (CHEs).
Chennu Ranganayakulu
wiley +1 more source
Numerical simulations of interrupted and conventional microchannel heat sinks
, 2008 We provide three-dimensional numerical simulations of conjugate heat transfer in conventional and the newly proposed interrupted microchannel heat sinks.
Song, Yanxi +4 more
core +1 more source
ChemSusChem, Volume 19, Issue 12, 26 June 2026.This review examines thermo‐ and photocatalytic routes for converting CO2 to ethanol and analyzes how metal alloying, promoters, supports, surface structure, and semiconductor design govern catalyst activity, selectivity, and stability. It integrates mechanistic insights from experimental and theoretical studies and identifies the main challenges and ...
Bryan Rocano‐Merchan +7 more
wiley +1 more source
Analysis of Interrupted Rectangular Microchannel Heat Sink with High Aspect Ratio
Journal of Applied Fluid Mechanics, 2017 A computational modelling of microchannel heat sinks with high aspect ratio has been performed to compare the geometrical features in the plane parallel to the heating surface and to determine the optimum configuration for the best heat transfer ...
Harshin Kamal, A. Dewan
doaj
Micromachines, 2023 Cooling methods for multiple heat sources with high heat flux have rarely been reported, but such situations threaten the stable operation of electronic devices.
Zhengyong Jiang +5 more
doaj +1 more source
3D Printing Innovations in Polymeric Porous and Patterned Architecture
Advanced Functional Materials, Volume 36, Issue 50, 22 June 2026.Polymeric foams occupy a unique structural space between dense solids and open networks, where engineered void fraction governs mechanical compliance, thermal resistance, and mass transport. Additive manufacturing now enables precise spatial control over cellular architecture, unlocking designer foam structures across applications spanning crash ...
Dhanush Patil +13 more
wiley +1 more source
Optimization of constructal design of a microchannel heat sink [PDF]
, 2006 Past studies have shown that a good microchannel design depends on its lower thermal resistance. However, latest theory based on entropy generation minimization (EGM) stated that lower entropy generation rate must also be considered for an optimized ...
Abidin, Ummikalsom
core
Sensors, 2020 This paper describes an experimental study of the cooling capabilities of microchannel and micro-pin-fin based on-chip cooling systems. The on-chip cooling systems integrated with a micro heat sink, simulated power IC (integrated circuit) and temperature
Yunlong Qiu +3 more
doaj +1 more source
Advanced Materials Interfaces, Volume 13, Issue 11, 9 June 2026.Schematic illustration of the carrier dynamics in the layered CuO∖TiO2 heterostructure. ABSTRACT Understanding the ultrafast carrier dynamics at the p‐n heterojunctions is indispensable for designing efficient photocatalysts. In this work, we used element‐specific time‐resolved soft X‐ray absorption spectroscopy (tr‐XAS) to investigate the ultrafast ...
Abhishek Katoch +5 more
wiley +1 more source