Results 91 to 100 of about 105,798 (293)
Controlled Growth of Boron Nitride in Various Phases
Advanced Materials Interfaces, EarlyView.Phase‐selective boron nitride growth is presented as a unified materials‐design problem across hexagonal, rhombohedral, cubic, and amorphous phases. By linking synthesis routes to thermodynamic stability, kinetic accessibility, surface diffusion, interfacial templating, and energetic activation, this review clarifies how bonding and stacking are ...
Pan Wu +6 more
wiley +1 more source
Thermoplastic Solutions for Photonics and Microelectronics Packaging
Thermoplastic injection molding is a technology that has yet to be fully utilized by the microelectronics packaging industry. Thermoplastic components have been used in opto-electronics packaging for years, namely in high volume telecommunications ...
Scot MacGillivray
core +1 more source
Recent Advances in Plasma‐Enhanced Atomic Layer Etching for Next‐Generation Nanofabrication
Advanced Materials Interfaces, EarlyView.Continued semiconductor miniaturization demands atomic‐scale patterning and ultralow surface roughness beyond the capabilities of conventional reactive ion etching. This review highlights advances in isotropic and anisotropic plasma‐enhanced atomic layer etching since 2020, covering fundamental mechanisms, applications across major semiconductor ...
Shih‐Nan Hsiao
wiley +1 more source
Global trends in microelectronics and place of Belarus in this process [PDF]
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, 2012 The review summarizes development of microelectronics in the developed countries over the period of 7—10 years until 2008, when the economic crisis started to effect the global economy.
Belous A. I. +3 more
doaj
Two‐Way Shape Memory Polymer Composite Gripper for Adaptive Robotic Applications
Advanced Materials Technologies, EarlyView.A two‐way shape memory polymer (SMP) composite is developed with intrinsic shape‐changing capability driven solely by temperature, eliminating external actuation loads. Embedding the SMP in a low‐stiffness elastomeric matrix enabled reversible transformations during heating and cooling cycles.
Aamna Hameed, Kamran Ahmed Khan
wiley +1 more source
Die attach failures related to wafer back metal processing - An AES study
, 1997 Microelectronics Reliability373519 ...
Radhakrishnan, M.K., M.K. Radhakrishnan
core +1 more source
Advanced Materials Technologies, EarlyView.A mask‐free and cost‐effective UV‐pico‐second laser‐based microfabrication method is proposed to fabricate large‐area biodegradable microelectrode arrays and pressure sensors. These devices demonstrate low impedance, good conformability, excellent biocompatibility, and rapid degradation, providing a new route for next‐generation transient electronics ...
Bhavani Prasad Yalagala +5 more
wiley +1 more source
Microelectronics compatible manufacturing techniques of microsystems
, 1996 International audienceThere are two ways to manufacture microsystems: to develop processes specific to microsystems (hence these processes can address requirements specific to microsystems) or to use processes that have been developed for ...
Karam, J.M., Paret, J.- M., Courtois, B.
core
The Zelenograd Center of Microelectronics
, 2006 International audienceThis article deals with appearance of microelectronics in the USSR and establishing of its innovation centre in Zelenograd, Moscow.
Malashevich, B., M., Malashevich, D., B.
core +1 more source