Results 141 to 150 of about 49,334 (299)
Contamination Control in Hybrid Microelectronic Modules. Part 1: Identification of Critical Process and Contaminants [PDF]
Various hybrid processing steps, handling procedures, and materials are examined in an attempt to identify sources of contamination and to propose methods for the control of these contaminants.
Himmel, R. P.
core +1 more source
CMOS‐Integrated Synaptic Photoreceptor Chip Inspired by Insect Visual Processing
CMOS‐integrated Si QDs/ReS2 synaptic photoreceptor array mimics the parallel processing and wavelength‐selective strategy of insect vision. By combining intrinsic ultraviolet‐violet sensitivity with synaptic plasticity, the chip enables frontend sensory redundancy reduction without external filters, offering a scalable pathway toward lowpower ...
Jian Chai +25 more
wiley +1 more source
The discipline of vacuum mechatronics is defined as the design and development of vacuum-compatible computer-controlled mechanisms for manipulating, sensing and testing in a vacuum environment.
Belinski, Steven E. +2 more
core +1 more source
This work proposes a high static magnetic field (HSMF) driven dual‐low‐dimension strategy for fabricating magnetic‐dielectric heterostructure (Fe3O4@MoS2) chains with programmable lengths. The constructed successive magnetic‐dielectric synergy, arising from uniaxial anisotropy‐enhanced magnetic response and abundant heterointerfaces that boost ...
Zhuolin Li +5 more
wiley +1 more source
Bismuth nanosheets integrated with nitrogen‐doped carbon nanoleaves are constructed via a 2D‐on‐2D heterointerface engineering strategy. The resulting BiNS/NCL electrode delivers high chloride adsorption capacity, fast kinetics, and stable cyclability. A built‐in electric field at the heterointerface promotes chloride electrosorption and stabilizes the
Bohan Liu +11 more
wiley +1 more source
3D Engineered Dual‐Redox Zinc‐Iodine Microbatteries for Intrinsically Safe on‐Chip Energy Storage
Dual‐redox Zn//I2 microbatteries enable high‐performance on‐chip energy storage by combining Zn2+ plating/stripping with reversible I−/I3− chemistry. Integrated with PANI micro‐cathode and 3D porous Au collectors, the system delivers enhanced capacity, energy, and power, advancing safe, CMOS‐compatible microsystems for next‐generation electronics ...
Nibagani Naresh +16 more
wiley +1 more source
Electric‐Current‐Induced Phase Transformation in Cu6Sn5 Below Its Equilibrium Transition Temperature
Electric current induces a monoclinic‐to‐hexagonal phase transformation in Cu6Sn5 at a measured bulk temperature of ∼120°C, below the equilibrium transition temperature. Ex situ synchrotron x‐ray diffraction, TEM, and matched thermal controls show that current stressing promotes the formation of a retained hexagonal η‐phase post‐stress state not ...
Shih‐kang Lin +3 more
wiley +1 more source
To overcome severe signal oscillation under extreme impact conditions, this work presents a Sensing‐in‐Energy microdevice which integrates a MEMS inertial structure directly within a supercapacitor electrolyte cavity. Utilizing shock‐driven transient contact and electrolyte damping for signal self‐filtering, it achieves weak‐oscillation, large ...
Zhihao Zheng +7 more
wiley +1 more source
This tutorial introduces a practical framework for implementing early‐stage Life‐Cycle Assessment (LCA) in flexible and printed electronics. Using organic electrochemical transistors (OECTs) as a case study, the modular Process‐of‐Record and open‐access inventory provides a rich resource adaptable to a plethora of technologies in printed electronics ...
Laura Teuerle +6 more
wiley +1 more source
Thermal management of 3-D heterogeneously integrated microelectronics: challenges and future research directions. [PDF]
Sharma MK, Ramos-Alvarado B.
europepmc +1 more source

