Results 291 to 300 of about 1,052,060 (355)
A multifunctional hydroxyapatite (HAp) coating integrated with silver‐gallium liquid metal nanoparticles (HAp‐Ag‐GaNPs) exhibits dual antibacterial and osteogenic properties. It effectively inhibits Gram‐positive and Gram‐negative bacteria, including resistant strains, while enhancing bone regeneration.
Ngoc Huu Nguyen+17 more
wiley +1 more source
Human Skin-Inspired Staggered Microstructures for Optimizing Sensitivity of Flexible Pressure Sensor. [PDF]
Li K, Yang Y.
europepmc +1 more source
Self‐organized Criticality in Neuromorphic Nanowire Networks With Tunable and Local Dynamics
Memristive nanowire networks (NWNs) are shown to be electrically tunable to a critical state where specific local dynamics evaluated by multiterminal characterization are exploited as feature selection in nonlinear transformation (NLT) tasks.
Fabio Michieletti+3 more
wiley +1 more source
White matter microstructure abnormalities in thalassemia patients using TBSS analysis based on DTI. [PDF]
Yang M+6 more
europepmc +1 more source
A Study of Machinability of Metals : Effect of Microstructure of Metals on Cutting Mechanism
Keiji Okushima+2 more
openalex +2 more sources
The separation of Helium gas from natural gas is challenging but highly important. MIL‐116(Ga), a “non‐porous” metal–organic framework is used as a molecular sieve to separate He from CH4. Druse‐like MIL‐116(Ga) particles are integrated into polysulfone mixed matrix membranes.
Ayisha Komal+10 more
wiley +1 more source
Theoretical and Experimental Study on the Surface Microstructures of Polyimide in Ultra-Precision Fly-Cutting. [PDF]
Liu J, Wang S, Zhao Q.
europepmc +1 more source
Carbon Nanotube 3D Integrated Circuits: From Design to Applications
As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu+3 more
wiley +1 more source