Results 251 to 260 of about 1,709,207 (373)
3D Printing of Highly Electrically Conductive Zinc for Sustainable Electronics Applications
A 3D printable zinc ink system with active zinc particles in a shellac matrix is demonstrated. The results show high conductivity, stable performance of printed structures under varying humidity conditions, and promising application in disposable water‐activated batteries. This technology combining digital material assembly, reliable operation, and non‐
Xavier Aeby+5 more
wiley +1 more source
Simulation and performance analysis of plasma switch for microwave amplification in T shaped circular waveguide in the S band. [PDF]
Taghinejad J, Rahmani M, Niknam AR.
europepmc +1 more source
High-quality graphene via microwave reduction of solution-exfoliated graphene oxide
D. Voiry+7 more
semanticscholar +1 more source
Utilizing a novel (Ni81Fe19/Ti)4/Cu/(Ni81Fe19/Ti)4 thin‐film multilayer with low coercive field, low damping and a superior GMI ratio, a compact, low‐noise unbiased FMR‐driven integrated GMI sensor with a superior magnetic noise performance of ≈100 pT/√Hz is first demonstrated, owing to reduced phase noise from well‐defined aligned magnetic domains and
Bin Luo+8 more
wiley +1 more source
Preface to 'Microwave science in sustainability'. [PDF]
Slocombe DR, Porch A.
europepmc +1 more source
Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek+4 more
wiley +1 more source
Quantum sensing of broadband spin dynamics and magnon transport in antiferromagnets. [PDF]
Melendez AL+10 more
europepmc +1 more source
This article presents a novel strategy for creating highly stretchable wireless circuits using electrical metamaterial‐based interconnects (EMIs). Embedded in soft polymers and filled with liquid metal, EMIs uniquely reduce resistance under strain. A fully integrated ECG circuit demonstrates reliable performance under 100% stretch, offering a highly ...
Anan Zhang+2 more
wiley +1 more source
An Experimental Study of the Propagation of Microwave over Snow Cover
S. OTAKA, Taro Hasegawa, M. Suzuki
openalex +2 more sources