Results 111 to 120 of about 99,046 (328)

Coexistence of multiuser entanglement distribution and classical light in optical fiber network with a semiconductor chip

open access: yesChip
Building communication links among multiple users in a scalable and robust way is a key objective in achieving large-scale quantum networks. In a realistic scenario, noise from the coexisting classical light is inevitable and can ultimately disrupt the ...
Xu Jing   +13 more
doaj  

Analysis of Microwave Passive Circuits Designed Using 3D Printing Techniques

open access: yesElektronika ir Elektrotechnika, 2019
This work presents the results of a preliminary study conducted to assess the viability of using 3D printing techniques for the manufacturing of microwave passive circuits based on microstrip techniques, both for prototyping new low-cost devices and for ...
Hector Garcia-Martinez   +4 more
doaj   +1 more source

Low‐Noise, Unbiased Ferromagnetic‐Resonance‐Driven Thin‐Film Integrated Giant Magnetoimpedance Sensors

open access: yesAdvanced Materials Technologies, EarlyView.
Utilizing a novel (Ni81Fe19/Ti)4/Cu/(Ni81Fe19/Ti)4 thin‐film multilayer with low coercive field, low damping and a superior GMI ratio, a compact, low‐noise unbiased FMR‐driven integrated GMI sensor with a superior magnetic noise performance of ≈100 pT/√Hz is first demonstrated, owing to reduced phase noise from well‐defined aligned magnetic domains and
Bin Luo   +8 more
wiley   +1 more source

Defected Ground Structure: Fundamentals, Analysis, and Applications in Modern Wireless Trends

open access: yesInternational Journal of Antennas and Propagation, 2017
Slots or defects integrated on the ground plane of microwave planar circuits are referred to as Defected Ground Structure. DGS is adopted as an emerging technique for improving the various parameters of microwave circuits, that is, narrow bandwidth ...
Mukesh Kumar Khandelwal   +2 more
doaj   +1 more source

Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging

open access: yesAdvanced Materials Technologies, EarlyView.
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek   +4 more
wiley   +1 more source

Electrical Metamaterial‐Based Interconnects‐Enabled Highly Stretchable Wireless Electrocardiography Circuit

open access: yesAdvanced Materials Technologies, EarlyView.
This article presents a novel strategy for creating highly stretchable wireless circuits using electrical metamaterial‐based interconnects (EMIs). Embedded in soft polymers and filled with liquid metal, EMIs uniquely reduce resistance under strain. A fully integrated ECG circuit demonstrates reliable performance under 100% stretch, offering a highly ...
Anan Zhang   +2 more
wiley   +1 more source

The Experimental UWB Link [PDF]

open access: yes, 2005
The experimental results from simple ultra wideband link are presented. The UWB link consisting of typical broadband microwave circuits built of commercially available components is able to send and detect unmodulated broadband electrical pulses with
Le Kernec, Julien   +3 more
core  

Transfer-matrices for series-type microwave antenna circuits [PDF]

open access: yes
Transfer matrices are developed which permit analysis and computer evaluation of certain series type microwave antenna circuits associated with an L-Band microwave radiometer (LBMR) under investigation at Goddard Space Flight Center.
Schmidt, R. F.
core   +1 more source

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