Results 231 to 240 of about 1,558,347 (389)

Microstructure Evolution of a VMnFeCoNi High‐Entropy Alloy After Synthesis, Swaging, and Annealing

open access: yesAdvanced Engineering Materials, EarlyView.
The synthesis and processing (rotary swaging and annealing) of the novel VMnFeCoNi alloy is investigated, alongside the estimation of the grain size effect on hardness. Analysis of a wide grain size range of recrystallized microstructures (12–210 µm) reveals a low annealing twin density.
Aditya Srinivasan Tirunilai   +6 more
wiley   +1 more source

Correction to: Elevated APOBEC3B expression drives a kataegic-like mutation signature and replication stress-related therapeutic vulnerabilities in p53-defective cells. [PDF]

open access: yesBr J Cancer
Nikkilä J   +14 more
europepmc   +1 more source

Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators

open access: yesAdvanced Engineering Materials, EarlyView.
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad   +6 more
wiley   +1 more source

A Study Protocol for a Randomized, Controlled Trial: Improving Glucose Time-in-Range in Diabetes in African Youth (DAYTime). [PDF]

open access: yesMethods Protoc
Piloya-Were T   +7 more
europepmc   +1 more source

Evaluation of Plasticity and Creep Parameters From Tensile Stress–Strain Data for a Range of Strain Rates

open access: yesAdvanced Engineering Materials, EarlyView.
This plot compares experimental tensile stress–strain curves (with 4 different strain rates) and corresponding modelled curves (obtained using the optimised sets of Voce and Miller–Norton parameter values shown). The inferred M‐N values, characterizing the creep, are very similar to those obtained via conventional creep testing.
S. Ooi, R. P. Thompson, T. W. Clyne
wiley   +1 more source

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