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Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

Acute rheumatic fever in the UK and Ireland: a BPSU surveillance study. [PDF]

open access: yesArch Dis Child
Gourlay-Gudex M   +4 more
europepmc   +1 more source

Fixed points of multivalued convex contractions with application. [PDF]

open access: yesPLoS One
Khan AR   +3 more
europepmc   +1 more source

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