Results 141 to 150 of about 231,562 (296)
Advanced Science, EarlyView.In this study, FeCoNiCuPt high‐entropy alloy particles (HEA) are loaded onto protonated g‐C3N4 nanosheets (HCN NSs) to construct HEA/HCN composites through an electrostatic self‐assembly method. Protonation treatment enriches the surface of g‐C3N4 nanosheets with abundant active sites and enhances their interfacial charge separation capability ...
Yunzhu Zang +3 more
wiley +1 more source
Advanced Science, EarlyView.The barrier layer is designed comprehensively by thermal expansion coefficient and interfacial reaction energy to yield a controlled interfacial reaction. Ultimately, the Co25Fe50Ni25/half‐Heusler joint simultaneously achieves low contact resistivity and high bonding strength.
Jian Liang +11 more
wiley +1 more source
Advanced Science, EarlyView.Hierarchical PP–LSR107–BaTiO3 nanocomposite films are fabricated by one‐step extrusion and stretching for roll‐to‐roll manufacture, combining high energy storage and processing flexibility. LSR107 surrounds BaTiO3‐rich regions, locating amorphous PP, decreasing defects, and introducing deep traps that homogenize the electric field and suppress charge ...
Yi Gao +14 more
wiley +1 more source
Advanced Science, EarlyView.A Cu‐mediated Ni(OH)2 catalyst with orthogonal activity by precise valence engineering simultaneously accelerates rate‐determining aldehyde C─H activation in HMF oxidation and impedes O─H deprotonation in competing OER. This multi‐functional synergistic catalysis enables FDCA production at industrial‐level current densities without sacrificing FEFDCA ...
Junge Yang +7 more
wiley +1 more source
Advanced Electronic Materials, EarlyView.This tutorial introduces a practical framework for implementing early‐stage Life‐Cycle Assessment (LCA) in flexible and printed electronics. Using organic electrochemical transistors (OECTs) as a case study, the modular Process‐of‐Record and open‐access inventory provides a rich resource adaptable to a plethora of technologies in printed electronics ...
Laura Teuerle +6 more
wiley +1 more source
SPICE‐Compatible Compact Modeling of Cuprate‐Based Memristors Across a Wide Temperature Range
Advanced Electronic Materials, EarlyView.A physics‐guided compact model for YBCO memristors is introduced, incorporating carrier trapping, field‐induced detrapping, and a differential balance equation to describe their switching dynamics. The model is compared with experiments and implemented in LTspice, allowing realistic circuit‐level simulations.
Thomas Günkel +6 more
wiley +1 more source
Advanced Electronic Materials, EarlyView.A Cu/Al bilayer design is developed to protect copper metal‐mesh transparent electrodes from oxidation. The ultrathin Al layer self‐passivates into a dense Al2O3 barrier, ensuring excellent stability under harsh conditions. The resulting electrodes combine high conductivity and transparency, enabling reliable operation in flexible touch sensors and ...
Yourong Shu +11 more
wiley +1 more source
Advancing Energy Materials by In Situ Atomic Scale Methods
Advanced Energy Materials, Volume 15, Issue 11, March 18, 2025.Progress in in situ atomic scale methods leads to an improved understanding of new and advanced energy materials, where a local understanding of complex, inhomogeneous systems or interfaces down to the atomic scale and quantum level is required. Topics from photovoltaics, dissipation losses, phase transitions, and chemical energy conversion are ...
Christian Jooss +21 more
wiley +1 more source