Results 141 to 150 of about 188,708 (309)
Mixed-Mode and Mode-II Fatigue Crack Growth in Woven Composites
A woven carbon/epoxy composite was subjected to fatigue crack growth under mixed Mode-I/Mode-II loading to obtain crack growth behavior at different cyclic strain energies. Owing to the woven structure of the material, pure Mode-II fracture is usually a difficult proposition because of friction, interference, and interlock of woven tows in adjacent ...
Joel S. Fenner, Isaac M. Daniel
openaire +2 more sources
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz +5 more
wiley +1 more source
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya +2 more
wiley +1 more source
Fracture toughness testing of polymer matrix composites [PDF]
A review of the interlaminar fracture indicates that a standard specimen geometry is needed to obtain consistent fracture toughness measurements in polymer matrix composites.
Grady, Joseph E.
core +1 more source
Advanced Techniques for Scalable Woven E‐Textiles Manufacturing
This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin +2 more
wiley +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
A convenient way to represent fatigue crack growth in structural adhesives [PDF]
Hu, W, Jones, R, Kinloch, AJ
core +1 more source
Photothermomechanically Efficient, Low‐Cost, High‐Cycle‐Life, Hybrid MXene‐Polymer Actuators
The addition of MXenes to elastomer‐plastic‐paper films enables the creation of easily prepared actuators that are scalable for small robotic applications. Known as MXene‐polymer Trilayer Actuators (MPTAs), they bend from UV light. Their usefulness is demonstrated through kirigami‐inspired flower‐shaped art design, parallel manipulator for waveguiding,
Ken Iiyoshi +6 more
wiley +1 more source
Laser Micromachining of Liquid Metal Patterns for Stretchable Electronic Circuits
A cleanroom‐free fabrication strategy combines UV‐laser micromachining with a copper foil wetting layer to rapidly produce high resolution, liquid metal based stretchable electronic circuits on diverse substrates. The scalable, maskless process enables complex circuit designs (<$<$3 h, ∼$\sim$15/device) with excellent electrical stability under strain,
Merjen Palvanova +3 more
wiley +1 more source
This review outlines how understanding bone's biology, hierarchical architecture, and mechanical anisotropy informs the design of lattice structures that replicate bone morphology and mechanical behavior. Additive manufacturing enables the fabrication of orthopedic implants that incorporate such structures using a range of engineering materials ...
Stylianos Kechagias +4 more
wiley +1 more source

