Results 101 to 110 of about 459,637 (360)
The share of technical thermoplastics is expected to grow further in the e‐mobility segment. In this study, a detailed temperature‐based tribological characterization of technical thermoplastics is performed. The tribological properties are discussed in terms of the dynamic mechanical properties of polymers at different ambient temperatures. A proof of
Harsha Raghuram+2 more
wiley +1 more source
The role of various alloying elements in face‐centered cubic aluminum on the barrier of a Shockley partial dislocation during its motion is presented. The study aims to understand how alloying atoms such as Mg, Si, and Zr affect the energy landscape for dislocation motion, thus influencing the solid solution hardening and softening in aluminum, which ...
Inna Plyushchay+3 more
wiley +1 more source
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source
Research on incentive mechanism for mobile intelligent edge computing
As a new architecture,mobile edge computing gives edge users stronger capabilities of computing,storage and communication,but it needs reasonable incentives mechanism to motivate edge users to provide resources.In terms of the three typical scenarios of ...
Shuyun LUO+3 more
doaj +2 more sources
High‐Temperature Oxidation of the CrFeNi Medium‐Entropy Alloy
The oxidation behavior of equiatomic CrFeNi MEA is a key issue that determines this material's suitability for high‐temperature application. The understanding of long‐term behavior is even more crucial than short‐term corrosion effects. The alloy is exposed to synthetic air at 1000, 1050, and 1100 °C for 24, 100, and 1000 h and systematically compared ...
Anna Maria Manzoni+5 more
wiley +1 more source
IEEE Access Special Section Editorial: Mobile Edge Computing for Wireless Networks
The growing popularity of smart mobile devices has not only triggered an exponential increase in mobile data traffic, but also boosted the computation demands and requirements to an unprecedented level. Meanwhile, the next generation wireless networks, i.
Guanding Yu+4 more
doaj +1 more source
This study presents a hyperelastic mechanical metamaterial for elastic energy dissipation. Energy is dissipated within its unit cells by friction assisted by material damping. Frictional contact is enhanced when using auxetic unit cells. The load–displacement plot for one compression cycle shows a pronounced hysteresis loop, indicating that a large ...
Eunhyeuk Jeong+2 more
wiley +1 more source
Hierarchical Mobile Edge Computing Architecture Based on Context Awareness
Due to the recent developments in mobile network technology and the supply of mobile devices, services that require high computing power and fast access speed, such as machine learning and multimedia streaming, are attracting attention.
Juyong Lee, Jihoon Lee
doaj +1 more source
Experiments for reinforcing the diffusion bonding plane by the oxide dispersion strengthening effect are presented. Small ceramic particles (0.5 and 50 μm, respectively) are incorporated. Furthermore, ceramic particles help to penetrate stable passivation layers, enabling atomic diffusion across bonding planes. Since a ceramic–metallic interface cannot
Thomas Gietzelt+4 more
wiley +1 more source
A survey of mobile edge computing
Mobile edge computing (MEC) technology integrates IT service environment and cloud computing technology at the edge of the network,improving the capacities of computing and storage of the edge of network,reducing network operation and service delivery delay and further enhancing the quality of experience (QoE) of users.Thus,MEC has attracted extensive ...
Zishu LI, Renchao XIE, Li SUN, Tao HUANG
openaire +2 more sources