Results 111 to 120 of about 459,637 (360)
Fluid Antenna for Mobile Edge Computing
In the evolving environment of mobile edge computing (MEC), optimizing system performance to meet the growing demand for low-latency computing services is a top priority. Integrating fluidic antenna (FA) technology into MEC networks provides a new approach to address this challenge.
Yiping Zuo+5 more
openaire +2 more sources
The influence of Hot Isostatic Pressing (HIP) temperature on the microstructure and creep performance of powder bed fusion–laser beam processed CM247LC superalloy is investigated. Grain growth and γ’ precipitate evolution are characterized following HIP at varying temperatures.
Ahmed Fardan+4 more
wiley +1 more source
Joint communication and computing resource allocation in vehicular edge computing
The emergence of computation-intensive vehicle applications poses a significant challenge to the limited computation capacity of on-board equipments. Mobile edge computing has been recognized as a promising paradigm to provide high-performance vehicle ...
Jianan Sun+4 more
doaj +1 more source
Scanning transmission electron microscopy imaging techniques are an essential tool to document dynamic developments, such as precipitation in aluminum alloys, during in situ heating experiments using transmission electron microscopy. However, in many cases, chemical information is required to interpret complex nanoscale processes.
Evelin Fisslthaler+4 more
wiley +1 more source
Mobile Edge Computing (MEC) is an innovative technique, which can provide cloud-computing near mobile devices on the edge of networks. Based on the MEC architecture, this paper proposes an ARIMA-BP-based Selective Offloading (ABSO) strategy, which ...
Ming Zhao, Ke Zhou
doaj +1 more source
Bimetallic structures of Inconel 718 and CuCrZr are fabricated using the laser powder directed energy deposition method. The study reveals a strong dependence of interface characteristics such as width and interfusion on processing and heat treatment strategies.
Hamidreza Javidrad, Bahattin Koc
wiley +1 more source
A
Junguk Cho+4 more
openalex +1 more source
This study identifies 12 wt% indium (In) as the optimal composition for Sn0.5Ag0.7Cu5Bi solder joints, achieving 87% ductile fracture and 81% suppression of intermetallic compound (IMC) growth versus 4 wt% In. High‐In alloys (15–17 wt%) show abnormal IMC thickening due to thermal activation.
Liuwei Wang+11 more
wiley +1 more source
A solution for flexible adaption of network services in mobile edge computing
In order to cope with the challenges brought by the “internet of everything”,mobile edge computing has been highly valued by academics and industry for its unique advantages.However,traditional IP networks are unable to provide network services ...
Bohao FENG, Huachun ZHOU
doaj +2 more sources
Equal channel angular pressing of commercial pure copper under low strain amplitude (≈0.48) induces concurrent continuous and localized discontinuous dynamic recrystallization, forming a duplex structure influenced by strain heterogeneity and recovery. Moderate hardening after 4–12 passes results from progressive high‐angle grain boundary formation via
Paula Cibely Alves Flausino+6 more
wiley +1 more source