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Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source
Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Advanced Materials Technologies, EarlyView.Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek +4 more
wiley +1 more source
Advanced Materials Technologies, EarlyView.This paper contrasts electrospinning and 3D printing for porous membrane fabrication, evaluating their evolution, cost, resolution, mechanical traits, and scalability. While 3D printing excels in material diversity and industrial adaptability, electrospinning achieves finer resolution and thermal resilience.
Eya Kacem +6 more
wiley +1 more source
Advanced Materials Technologies, EarlyView.This review highlights recent advancements in 3DP techniques that incorporate emerging multifunctional SMP materials for applications in e‐electronics, soft actuators, biomedical devices, and more. Abstract Shape memory polymers (SMP) have recently gained significant attention as multifunctional materials for flexible and wearable electronics ...
Muhammad Yasir Khalid +4 more
wiley +1 more source
How to Manufacture Photonic Metamaterials
Advanced Materials Technologies, EarlyView.Metamaterials boast applications such as invisibility and “hyperlenses” with resolution beyond the diffraction limit, but these applications haven’t been exploited in earnest and the market for them hasn’t grown much likely because facile and economical methods for fabricating them without defect has not emerged.
Apurba Paul, Gregory Timp
wiley +1 more source
Modal Logics for Reasoning about Object-based Component Composition [PDF]
, 2000 Claus Pahl
openalex +1 more source
Silicon‐Integrated Next‐Generation Plasmonic Devices for Energy‐Efficient Semiconductor Applications
Advanced Materials Technologies, EarlyView.Silicon (Si)‐integrated plasmonics offer a pathway to next‐generation, energy‐efficient semiconductor applications. This review highlights advances using complementary metal–oxide–semiconductor (CMOS)‐compatible materials like transparent conductive oxides and novel architectures, particularly coupled hybrid plasmonic waveguides (CHPWs).
Nasir Alfaraj, Amr S. Helmy
wiley +1 more source