Results 121 to 130 of about 803,319 (299)
The article presents the study results of resiliency modalities and the content of psychoeducational measures for higher education seekers in war conditions. The purpose of the study was to increase the effectiveness and to balance resiliency modalities
V.V. Ogorenko +5 more
doaj +1 more source
Opposite Hand Preferences in Two Sense-modalities [PDF]
G. Ettlinger +2 more
openalex +1 more source
The unrolling of the peltate leaves in Syngonium podophyllum is analyzed and quantified (left‐hand side to center). These measurements serve to verify a mathematical model for leaf unrolling based on the model used in Schmidt (2007). An additional formula for obtaining a layer mismatch from a prescribed radius is derived.
Michelle Modert +4 more
wiley +1 more source
Logical consequence in modal logic: Natural deduction in ${\rm S}5$. [PDF]
John Corcoran, George Weaver
openalex +1 more source
Bridging Nature and Technology: A Perspective on Role of Machine Learning in Bioinspired Ceramics
Machine learning (ML) is revolutionizing the development of bioinspired ceramics. This article investigates how ML can be used to design new ceramic materials with exceptional performance, inspired by the structures found in nature. The research highlights how ML can predict material properties, optimize designs, and create advanced models to unlock a ...
Hamidreza Yazdani Sarvestani +2 more
wiley +1 more source
Modal systems in which necessity is ``factorable''. [PDF]
J. Jay Zeman
openalex +1 more source
This work reveals the phase composition and quantitative morphology analysis of precipitation‐hardened Fe32Cu12Ni11Ti16Al29 complex‐concentrated alloy. The precipitates are shown to have a high coherency. Morphology transition between sphere, cuboidal, and elongated morphology is observed. Finally, the overaging behavior is captured using microhardness.
Rostyslav Nizinkovskyi +4 more
wiley +1 more source
Influence of Boundary Conditions on the Modal Characteristics of Thin Cylindrical Shells [PDF]
Kevin Forsberg
openalex +1 more source
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke +3 more
wiley +1 more source

