Results 281 to 290 of about 3,489,712 (358)
A Roadmap for Plasma‐Enabled Electrocatalysis in Urea Production
A modular plasma—electrochemical platform enables fully electrified urea synthesis from air and CO2 under ambient conditions. This Review integrates plasma oxidation, C─N coupling electrolysis, mechanistic insights, and techno‐economic metrics into a roadmap for scalable, distributed, and renewable fertilizer production.
Jingwen Huang+6 more
wiley +1 more source
Generation of femtosecond polygonal optical vortices from a mode-locked quasi-frequency-degenerate laser. [PDF]
Liu H+9 more
europepmc +1 more source
Fully Reshapeable and Recyclable Protein Hydrogels
By taking advantage of the substantial stiffness contrast between protein hydrogels in their folded and unfolded protein states as well as reversible disulfide crosslinking, a robust and general strategy is reported to engineer fully reshapeable and recyclable protein hydrogels.
Qingyuan Bian, Hongbin Li
wiley +1 more source
Self-locked broadband Raman-electro-optic microcomb. [PDF]
Wan S+8 more
europepmc +1 more source
Antiferromagnets (AF) are a promising platform for high‐speed, low‐power spintronic devices. AF also play a relevant role for interface‐engineering in ferromagnet/normal‐metal (FM/NM) heterostructures to enhance spin‐current transmission. In this role, controlling the Néel vector orientation is key.
Shoulong Chen+8 more
wiley +1 more source
Soft Electromagnetic Actuator and Oscillator
This work presents a groundbreaking soft electromagnetic system capable of bistable actuation and self‐regulated oscillation. Using liquid metal and silicone as a compliant conductor, the actuator enables force generation, sensing, and feedback with minimal power.
Noah D. Kohls, Yi Chen Mazumdar
wiley +1 more source
Integrated multi-port multi-wavelength coherent optical source for beyond Tb/s optical links. [PDF]
Pirmoradi A+6 more
europepmc +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya+3 more
wiley +1 more source
Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek+4 more
wiley +1 more source
High Aspect Ratio, Superconducting Vacuum Gap Capacitor NEMS with Plate Distances Down to 32 nm
Fabrication of aluminium vacuum gap capacitor based NEMS is investigated with a free to move top electrode. To avoid collapse of the top electrode vertical stress gradient is controlled through sputter parameters. The result is wafer‐level high‐yield fabrication of vacuum gap capacitors with radii between 7 µm and 30 µm and integrated piezoactuators. A
Ioan Ignat, Daniel Platz, Ulrich Schmid
wiley +1 more source