Results 111 to 120 of about 68,383 (283)

COMPARATIVE APPRASAL OF VARIANTS OF INTERPOLATION DISPLACEMENT FIELDS ON THE EXAMPLES OF THE PROBLEM AXIALLY SYMMETRIC THE LOADED SHELL OF REVOLUTION

Structural Mechanics of Engineering Constructions and Buildings, 2011
Now for the analysis mode of deformation of the majority shell of constructions of a building and machine-building structure use modern computer complexes such, as ANSYS, NASTRAN, ABACUS and others.
J V Klochkov, A P Nikolaev, S S Marchenko, A A Shubovich   +3 more
doaj  

Unlocking the Power of Quercetin‐Encapsulated Mesoporous Bioactive Glass Nanoparticles: A Multifunctional Approach to Bone Regeneration

Advanced Engineering Materials, EarlyView.
Mesoporous bioactive glass nanoparticles (MBGNs) are investigated for bone regeneration given their remarkable structural and functional properties. MBGNs are functionalized with Mn and Cu and incorporated with quercetin, a natural flavonoid exhibiting antioxidant, anti‐inflammatory, and antimicrobial properties.
Giovanni Lo Bello, Qaisar Nawaz, Pier Francesco Ferrari, Laura Pastorino, Roberto Raiteri, Aldo R. Boccaccini   +5 more
wiley   +1 more source

The Structural Refinement of Commercial‐Purity Copper Processed by Equal Channel Angular Pressing with Low Strain Amplitude

Advanced Engineering Materials, EarlyView.
Equal channel angular pressing of commercial pure copper under low strain amplitude (≈0.48) induces concurrent continuous and localized discontinuous dynamic recrystallization, forming a duplex structure influenced by strain heterogeneity and recovery. Moderate hardening after 4–12 passes results from progressive high‐angle grain boundary formation via
Paula Cibely Alves Flausino, Nayara A. N. da Silva, Bárbara C. de Almeida, Taise M. Manhabosco, Elaine C. S. Corrêa, Maria T. P. Aguilar, Paulo R. Cetlin   +6 more
wiley   +1 more source

A Comprehensive Review of Additive Manufacturing for Space Applications: Materials, Advances, Challenges, and Future Directions

Advanced Engineering Materials, EarlyView.
Additive manufacturing (AM) transforms space hardware by enabling lightweight, high‐performance, and on‐demand production. This review outlines AM processes—powder bed fusion (PBF), directed energy deposition (DED), binder jetting (BJ), sheet lamination (SL), and material extrusion (ME)—applied to propulsion, satellite structures, and thermal devices ...
Stelios K. Georgantzinos, Eleni Papadopoulou, Grigorios Kostopoulos, Stefanos Voulgaris, Alexandra Tseni, Panteleimon Bakalis, Maria Gkara, Chara C. Mitropoulou, Nikos D. Lagaros   +8 more
wiley   +1 more source

Toward Maximum Utilization of Heavy Rare Earths in Sintered Nd–Fe–B Magnets by Grain Boundary Diffusion Source and Application Area Optimization

Advanced Engineering Materials, EarlyView.
In this work, the grain boundary diffusion process is optimized to maximize heavy rare earth utilization by strategic magnetic hardening of areas in the magnet such as corners or edges that are highly susceptible to demagnetization, as demonstrated by finite element magnetostatics simulation on an internal permanent magnet, synchronous traction motor ...
Abdullatif Durgun, Dominik Ohmer, Matthias Katter, Andreas Thul, Simon Steentjes, Hossein Sepehri Amin, Oliver Gutfleisch, Imants Dirba   +7 more
wiley   +1 more source

Requirements and Evaluation of Commercial Digital Light Processing 3D Printers for Upscaled Production of Microstructured Tissue Culture Devices

Advanced Engineering Materials, EarlyView.
Commercial light‐based 3D printers increasingly find use for industry‐scale production of microstructured tissue culture devices. How can commercial printer performance be assessed for a given application? This work introduces simplified quantitative metrics based on microstructural fidelity analysis, addressing key manufacturing challenges in scaling ...
Zoltán András Guller, Freja Høier, Rujing Zhang, Sandra Wilson, Niels B. Larsen   +4 more
wiley   +1 more source

Deformation Behavior of Optical Ceramic Nanomultilayers: The Role of Aperiodicity

Advanced Engineering Materials, EarlyView.
Ceramic nanomultilayers demonstrate optical and mechanical behavior tunability through aperiodicity. Within the studied systems, optically optimized coatings exhibit an average ultraviolet, visible, and near‐infrared spectral transmittance above 90%.
Danielle E. White, Wenjuan Cheng, Koushik Jagadish, Edoardo Rossi, Yu‐Tsun Shao, Andrea M. Hodge   +5 more
wiley   +1 more source

Impact of Structural Adhesive Hybridization Strategy on the Performance of In‐Mold Electronics Devices Across Thermoforming and Injection Molding

Advanced Engineering Materials, EarlyView.
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García, Nekane Lozano‐Hernandez, Maria Lluisa Maspoch, Enric Fontdecaba   +3 more
wiley   +1 more source

Ultrasonic Atomization Spray Coating of PCL on an Mg‐Based Alloy Enhanced by Plasma Electrolytic Oxidation for Improved Adhesion, Corrosion Resistance, and Biocompatibility

Advanced Engineering Materials, EarlyView.
Plasma electrolytic oxidation is combined with ultrasonic spray deposition of polycaprolactone (PCL) on WE43 magnesium alloy to improve adhesion, corrosion resistance, and cytocompatibility. The hybrid coating demonstrates significantly reduced hydrogen evolution and enhances mechanical bonding, offering a promising strategy for next‐generation ...
Seyed Masih Mousavizadeh, Atiyeh Adelinia, Frederick D. Crowley, Jamal Seyyed Monfared Zanjani, John J. E. Mulvihill, Mingzhi Yu, Ehsan Rezvani, Matthijn de Rooij, Michael D. Gilchrist, Nan Zhang   +9 more
wiley   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

Advanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke, John Wu, Alan L. Kastengren, Nikhilesh Chawla   +3 more
wiley   +1 more source