Results 201 to 210 of about 54,166 (309)

Progress in Strain Engineering of 2D‐Integrated Heterostructures for Ultrasensitive Sensors

open access: yesAdvanced Science, EarlyView.
 . ABSTRACT Two‐dimensional (2D) integrated heterostructures have emerged as a cornerstone in the advancement of next‐generation sensor technologies. These heterostructures, which combine materials with different dimensionalities, have led to significant breakthroughs in sensing performance and device integration.
That Buu Ton   +4 more
wiley   +1 more source

Extended Rice-Thomson analysis and atomistic simulations revealing grain boundary effects on fracture in refractory high-entropy alloys. [PDF]

open access: yesProc Natl Acad Sci U S A
Wang W   +8 more
europepmc   +1 more source

Synergistic Dual Slip‐Link Toughening of a Water‐Rich Double Network Hydrogel Combining Slide‐Ring and Highly Entangled Networks

open access: yesAdvanced Science, EarlyView.
Two distinct slip‐link mechanisms – the slide‐ring pulley effect and highly entangled chains – are combined in a water‐rich double network hydrogel, achieving synergistic toughening, near‐complete reversibility, and exceptional friction tear resistance at >$>$91 wt.% water.
Subhankar Mandal   +5 more
wiley   +1 more source

A Portable and Dual‐Button Microneedle Device Enables Intelligent Multimodal Laser Sensing

open access: yesAdvanced Science, EarlyView.
A portable and dual‐button microneedle device enables rapid interstitial fluid sampling. Coupled with multimodal laser sensing and AI‐assisted data processing, the platform enables simultaneous molecular and elemental analysis for minimally invasive and multiplexed health assessment toward point‐of‐care diagnostics.
Yuanchao Liu   +12 more
wiley   +1 more source

Fundamental Challenges, Physical Implementations, and Integration Strategies for Ising Machines in Large‐Scale Optimization Tasks

open access: yesAdvanced Electronic Materials, EarlyView.
Ising machines are emerging as specialized hardware solvers for computationally hard optimization problems. This review examines five major platforms—digital CMOS, analog CMOS, emerging devices, coherent optics, and quantum systems—highlighting physics‐rooted advantages and shared bottlenecks in scalability and connectivity.
Hyunjun Lee, Joon Pyo Kim, Sanghyeon Kim
wiley   +1 more source

Mode I Fracture Toughness Behaviour of Recyclable Piezoelectric Composites

open access: yesProcedia Structural Integrity
Miray Yasar   +4 more
openaire   +1 more source

MXenes: Bridging the Gap Between Advanced Materials and Sustainable Technologies in Energy and Environmental Applications

open access: yesAdvanced Electronic Materials, EarlyView.
MXenes, a family of two‐dimensional transition metal carbides and nitrides, exhibit exceptional physical and chemical properties tunable through surface functionalization. This review summarizes recent advances in MXene synthesis, property modulation, and composite fabrication.
Fatemeh Saeedi   +4 more
wiley   +1 more source

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