Results 221 to 230 of about 957,044 (346)

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

Advanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan, Tuan‐Khoa Nguyen, Quang Thang Trinh, Nam‐Trung Nguyen, Dzung Viet Dao, Yong Zhu   +5 more
wiley   +1 more source

Cytosolic WPRa4 and Plastoskeletal PMI4 Proteins Mediate Touch Response in a Model Organism Arabidopsis. [PDF]

Mol Cell Proteomics
Wu K, Yang N, Ren J, Liu S, Wang K, Dai S, Lu Y, An Y, Tian F, Gao Z, Yang Z, Zhang Y, Yu W, Li N.   +13 more
europepmc   +1 more source

Thermal Conductivity of Silicone Rubber Composites: Effects of Ceramic Fillers, Pressure, and Temperature

Advanced Engineering Materials, EarlyView.
This study investigates the influence of ceramic fillers—aluminum oxide, boron nitride, and a combination of aluminum oxide and zinc oxide—with different particle sizes, on the thermal conductivity of solid silicone rubber. Additionally, the impact of potential synergistic interactions from the simultaneous addition of selected fillers is explored to ...
Aryan Oktaee, Kevin Klier, Ralf‐Urs Giesen, Hans‐Peter Heim   +3 more
wiley   +1 more source

Evaluating the potential toxicity of ampicillin using <i>Drosophila melanogaster</i> as a model organism. [PDF]

Toxicol Rep
Singh AS, Pathak D, Jain S, Devi MS, Nongthomba U.   +4 more
europepmc   +1 more source

A Simulative Evaluation of Triply Periodic Minimal Surface Structures in the Context of Elastocaloric Applications

Advanced Engineering Materials, EarlyView.
A simulative evaluation of triply periodic minimal surface (TPMS) structures for an elastocaloric application under compressive load is performed. For the evaluation of the structure's performance, surface/volume ratio, generated heat and invested mechanical work are taken into account and are compared to a tube as a reference specimen.
Michael Fries, Paul Motzki, Dirk Bähre, Anne Jung   +3 more
wiley   +1 more source

Investigation of the Effects of Silicon Dioxide Nanoparticles and Environmental Contaminants on Immunocytotoxic and Antioxidant Defense Systems in Model Organism Galleria mellonella L. [PDF]

Biol Trace Elem Res
Tuncsoy B, Idikut M, Tuncsoy M.
europepmc   +1 more source

Arabidopsis thaliana: a powerful model organism to explore histone modifications and their upstream regulations. [PDF]

Epigenetics, 2023
Yu Y, Wang S, Wang Z, Gao R, Lee J.
europepmc   +1 more source

Azolla — A Model Organism for Plant Genomic Studies

, 2003
Yin‐Long Qiu, Jun Yu
openalex   +1 more source

The nicer side of E. coli: Escherichia coli as a model organism [PDF]

, 2005
Gavin H. Thomas
openalex   +1 more source

Effect of Copper Content on the Microstructure and Mechanical Properties of As‐Cast Refractory MoNbTi Multiprincipal Element Alloys

Advanced Engineering Materials, EarlyView.
Copper addition profoundly impacts MoNbTi multiprincipal element alloys. This study reveals copper's dual role, promoting microstructural refinement and strengthening intermetallics at optimal concentrations. An ideal copper content significantly boosts hardness and compressive strength, achieving superior mechanical performance.
Eder Lopes Ortiz, João Felipe Queiroz Rodrigues, Renato Baldan, Erik Poloni, Giovana da Silva Padilha, Wislei Riuper Osório, Ausdinir Danilo Bortolozo   +6 more
wiley   +1 more source