Results 31 to 40 of about 74,008 (307)

On isomorphisms between Siegel modular threefolds

, 2015
The Satake compactification of the moduli space of principally polarized abelian surfaces with a level two structure has a degree 8 endomorphism. The aim of this paper is to show that this result can be extended to other modular threefolds.
Perna, Sara
core   +1 more source

Plasmonic Enhancement of Fluorescence and Protein Dynamics in Living Mammalian Cells

Advanced Materials, EarlyView.
This study demonstrates plasmonic enhancement of the function of fluorescent voltage sensing proteins (genetically encoded voltage indicators, (GEVIs), QuasAr6) in live mammalian cells. Coupling to plasmonic nanoparticles does not just increase fluorescence, but influences the protein photocycle, creating a hybrid sensor with its response speed to ...
Marco Locarno, Qiangrui Dong, Marco Post, Xin Meng, Cristiano Glessi, Nynke Marije Hettema, Nidas Brandsma, Sebbe Blokhuizen, Alejandro Castañeda Garcia, Srividya Ganapathy, Thieme Schmidt, Lars van Roemburg, Bing Xu, Chun‐Ting Cho, Liedewij Laan, Miao‐Ping Chien, Daan Brinks   +16 more
wiley   +1 more source

Modularity of arithmetic special divisors for unitary Shimura varieties (with an appendix by Yujie Xu)

Forum of Mathematics, Sigma
We construct explicit generating series of arithmetic extensions of Kudla’s special divisors on integral models of unitary Shimura varieties over CM fields with arbitrary split levels and prove that they are modular forms valued in the arithmetic Chow ...
Congling Qiu, Yujie Xu
doaj   +1 more source

One‐Step Fabrication of Highly Transparent Superhydrophobic Coatings Via Atmospheric Pressure Radio Frequency Plasma Deposition

Advanced Materials Interfaces, EarlyView.
Atmospheric‐pressure RF plasma deposition enables the fabrication of transparent, superhydrophobic coatings with anti‐reflective functionality. Process optimization yields high optical transmittance, robust environmental stability, and self‐cleaning properties.
Sultan S. Ussenkhan, Baglan A. Kyrykbay, Almasbek U. Utegenov, Sagi A. Orazbayev, Assanali T. Sultanov, Maratbek T. Gabdullin, Tlekkabul S. Ramazanov, Yerassyl Yerlanuly   +7 more
wiley   +1 more source

Integer Modular Multiplication With Barrett Reduction and Its Variants for Homomorphic Encryption Applications: A Comprehensive Review and an Empirical Study

IEEE Access
Modular arithmetic calculations, such as modular addition and multiplication, are fundamental building blocks to Post-Quantum Cryptography (PQC) and Homomorphic Encryption (HE) systems. While modular addition has straightforward hardware implementations,
Ardianto Satriawan, Rella Mareta, Hanho Lee   +2 more
doaj   +1 more source

Parallel Electrical Integration of Photo Bio Electrochemical Systems (photo‐BESs): Performance Gains and Load Dependency

Advanced Materials Technologies, EarlyView.
Parallel wiring of bioelectrochemical devices with conventional generators unexpectedly boosts output. A biophotovoltaic paired with a solar cell delivers up to 50% more power at low loads than their separate contributions; a plant microbial fuel cell shows similar current gains.
Valeria Marsaglia, Paolo Bombelli, Ingrid Paoletti, Ioannis A. Ieropoulos, Christopher J. Howe   +4 more
wiley   +1 more source

Hyperbolic Planes [PDF]

, 1995
In this paper we consider a special class of arithmetic quotients of bounded symmetric domains which can roughly be described as higher- dimensional analogues of the Hilbert modular varities.
Hunt, Bruce
core   +2 more sources

The kernel of the modular representation and the Galois action in RCFT

, 2001
It is shown that for the modular representations associated to Rational Conformal Field Theories, the kernel is a congruence subgroup whose level equals the order of the Dehn-twist. An explicit algebraic characterization of the kernel is given.
Bantay, P.
core   +1 more source

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

Advanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco, Nicola Larovere, Antonio Zagaria, Antonio Pavone, Rosanna Rifino, Gianni Stano   +5 more
wiley   +1 more source

Arithmetic Framework to Optimize Packet Forwarding among End Devices in Generic Edge Computing Environments

Sensors, 2022
Multi-access edge computing implementations are ever increasing in both the number of deployments and the areas of application. In this context, the easiness in the operations of packet forwarding between two end devices being part of a particular edge ...
Pedro Juan Roig, Salvador Alcaraz, Katja Gilly, Cristina Bernad, Carlos Juiz   +4 more
doaj   +1 more source