Results 51 to 60 of about 964 (198)
Semiconducting THO‐C3N Monolayers for Ultrahigh Anisotropic Carrier Mobility
A precise site‐specific N‐doping strategy that drives a secondary electronic transition in net W is proposed, enabling the electronic properties transition from metal to Dirac semimetal and ultimately to semiconductor. The obtained THO‐C3N‐2 and THO‐C3N‐3 semiconductors exhibit high carrier mobilities and pronounced mobility anisotropy, with THO‐C3N‐2 ...
Rui Tan +7 more
wiley +1 more source
On modulus of noncompact convexity for a strictly minimalizable measure of noncompactness
In this paper we consider modulus of noncompact convexity ΔX,φ associated with the strictly minimalizable measure of noncompactness φ. We also give some its properties and show its continuity on the interval [0, φ(BX)).
Rekic-Vukovic, Amra +2 more
openaire +2 more sources
This study proposes a stretchable strain sensor that demonstrates a high gauge factor of 2.3 × 104 and excellent linearity (R2 = 0.98), while maintaining temperature insensitivity under applied strain. This performance is achieved through a microcrack architecture formed by stacking a brittle, low‐resistance material with a stretchable, high‐resistance
Yu Kato +4 more
wiley +1 more source
Properties of the modulus of continuity for monotonous convex functions and applications [PDF]
For a monotone convex function f ∈ C[a, b] we prove that the modulus of continuity w(f; h) is concave on [a, b] as function of h. Applications to approximation theory are obtained.
openaire +2 more sources
A bio‐inspired Micro‐wrinkled Janus elastomeric flexible strain sensor mimicking wrinkled‐leaf viburnum is developed. Endowed with a synergistic sensing mechanism including wrinkle‐guided microcracks, modulus‐gradient‐driven strain division, and a parallel conductive circuit, it achieves ultra‐high linearity, sensitivity, wide strain range, and ...
Jing Lin +11 more
wiley +1 more source
Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics
This review surveys emerging materials for thermal management in advanced electronic packaging, with emphasis on ceramic substrates and thermal interface materials. Multiscale simulations and mechanistic analyses are highlighted, alongside the emerging role of artificial intelligence in predicting thermal properties and guiding design, offering ...
Yongjun Huo +11 more
wiley +1 more source
Tunable Plug‐and‐Play Meta‐Nanogenerator Materials for Multi‐Range Force Measurements
The multifunctional and tunable meta‐nanogenerator material system combines a mechanical metamaterial and a triboelectric nanogenerator enabling self‐powered, real‐time force sensing across application‐specific ranges. Geometrical tuning adjusts stiffness and the force sensing range, while modular integration streamlines assembly.
Roshira Premadasa +6 more
wiley +1 more source
A physics‐guided machine learning framework estimates Young's modulus in multilayered multimaterial hyperelastic cylinders using contact mechanics. A semiempirical stiffness law is embedded into a custom neural network, ensuring physically consistent predictions. Validation against experimental and numerical data on C.
Christoforos Rekatsinas +4 more
wiley +1 more source
Explaining the Origin of Negative Poisson's Ratio in Amorphous Networks With Machine Learning
This review summarizes how machine learning (ML) breaks the “vicious cycle” in designing auxetic amorphous networks. By transitioning from traditional “black‐box” optimization to an interpretable “AI‐Physics” closed‐loop paradigm, ML is shown to not only discover highly optimized structures—such as all‐convex polygon networks—but also unveil hidden ...
Shengyu Lu, Xiangying Shen
wiley +1 more source
Harnessing Machine Learning to Understand and Design Disordered Solids
This review maps the dynamic evolution of machine learning in disordered solids, from structural representations to generative modeling. It explores how deep learning and model explainability transform property prediction into profound physical insight.
Muchen Wang, Yue Fan
wiley +1 more source

