Results 251 to 260 of about 13,479 (308)

3D monolithic integration

2011 IEEE International Symposium of Circuits and Systems (ISCAS), 2011
3D monolithic integration, thanks to its high vertical density of interconnections, is the only available option for applications requiring connections at the transistor scale. However to achieve 3D monolithic integration, some issues such as realization of high quality top film, high stability bottom FET, low thermal budget top FET still have to be ...
P. Batude, M. Vinet, A. Pouydebasque, C. Le Royer, B. Previtali, C. Tabone, J.-M. Hartmann, L. Sanchez, L. Baud, V. Carron, A. Toffoli, F. Allain, V. Mazzocchi, D. Lafond, S. Deleonibus, O. Faynot   +15 more
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Enabling 3D Monolithic Integration

ECS Meeting Abstracts, 2008
Abstract not Available.
Perrine Batude, Maud Vinet, Laurent Clavelier, Arnaud Pouydebasque, Cyrille LeRoyer, Claude Tabone, Bernard Previtali, Loic Sanchez, Laurence Baud, Antonio Roman, Véronique Carron, Fabrice Nemouchi, Stéphane Pocas, Corine Comboroure, François Aussenac, Simon Deleonibus   +15 more
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A monolithically integrated multi-sensor platform

2015 IEEE SENSORS, 2015
The integration of multiple sensors on a single substrate is reported in this paper. A test chip was designed using the integration platform that implemented a capacitive inertial sensor, a capacitive absolute pressure sensor and a capacitive microphone.
Niladri Banerjee, Aishwaryadev Banerjee, Nazmul Hasan, Shashank Shekhar Pandey, Bishnu P. Gogoi, Carlos H. Mastrangelo   +5 more
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Monolithic 3D Integrated Circuits

2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), 2007
3D IC's promise to solve the 2D communication bottleneck, and enable the integration of heterogeneous materials, devices and systems. There are at least three approaches to realize 3D IC's : chip stacking, wafer stacking and full monolithic integration. Each approach is at a different level of maturity and offers various degree of improvement.
Simon Wong, Abbas El-Gamal, Peter Griffin, Yoshio Nishi, Fabian Pease, James Plummer   +5 more
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Monolithic 3-D Integration

IEEE Micro, 2019
The demands of future applications in computing (from self-driving cars to bioinformatics) overwhelm the projected capabilities of current electronic systems. The need to process unprecedented amounts of loosely structured data is driving the push for ultradense and fine-grained integration of traditionally off-chip components (e.g., sensors, memories)
Mindy D. Bishop, H.-S. Philip Wong, Subhasish Mitra, Max M. Shulaker   +3 more
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MEMS Monolithic Integration Technology

Key Engineering Materials, 2013
The monolithic integrated technology of MEMS was discussed. First discussed the advantages and difficulties faced by the MEMS monolithic integration technology. Second the features and the process of the mainstream MEMS monolithic integration technology was introduced. And finally put forward a SOI MEMS monolithic integration technology, the technology
Zhao Yun Zhang, Zhi Gui Shi, Zhen Chuan Yang, Bo Peng   +3 more
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Monolithic GaAs/Si Integration

MRS Proceedings, 1988
AbstractThe recent demonstrations of room-temperature cw operation of diode lasers fabricated in GaAs/AlGaAs layers grown on Si wafers have encouraged efforts to develop monolithic GaAs/Si integration technology for applications such as optical interconnects between VLSI subsystems.
George W. Turner, H. K. Choi, J. P. Mattia, C. L. Chen, S. J. Eglash, B-Y. Tsaur   +5 more
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Monolithic integrated circuits

IEEE Spectrum, 1964
A single-crystal chip of silicon contains both active and passive elements. Parasitic capacitance introduced during monolithic construction and circuit performance can now be analyzed Monolithic integrated circuits derive their name from the fact that the entire integrated circuit is formed in a single-crystal chip of silicon semiconductor.
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Millimeter-wave monolithic integrated circuits

1988., IEEE MTT-S International Microwave Symposium Digest, 1986
The progress, trends, and technical issues associated with monolithic millimeter-wave research are summarized. Background information intended to set forth a description of the opportunities which spur this effort and a summary of some of the important technical challenges are presented.
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Monolithic integrated selection circuit

The Journal of the Acoustical Society of America, 1980
The circuit enables the selection of the upper or the lower tone of an electronic organ chord with regard to a switching signal. In response to said switching signal each tone frequency signal handled is either fed to the anode or the cathode of a switch component of a plurality of switch components connected in series whereas the switch components of ...
Dieter Holzmann, Dirk Hoffmeister
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