Results 91 to 100 of about 414,665 (293)

A Nitsche-based domain decomposition method for hypersingular integral equations

open access: yes, 2011
We introduce and analyze a Nitsche-based domain decomposition method for the solution of hypersingular integral equations. This method allows for discretizations with non-matching grids without the necessity of a Lagrangian multiplier, as opposed to the ...
Chouly, Franz, Heuer, Norbert
core   +2 more sources

Chemically Doped Conductive Polymers for Wearable Health Monitoring

open access: yesAdvanced Materials Technologies, EarlyView.
Among conductive polymers, poly(3,4‐ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS), polyaniline (PANI), and polypyrrole (PPy) are the most studied and applied. Chemical doping significantly boosts intrinsic conductivity and mechanical robustness.
Mengdi Zuo   +5 more
wiley   +1 more source

The Coiled Serpent of Argument: Reason, Authority, and Law in a Talmudic Tale [PDF]

open access: yes, 2004
One of the most celebrated Talmudic parables begins with a remarkably dry legal issue debated among a group of rabbis. A modern reader should think of the rabbis as a collegial court, very much like a secular appellate court, because the purpose of their
Luban, David
core   +2 more sources

A segmentation-free isogeometric extended mortar contact method

open access: yes, 2018
This paper presents a new isogeometric mortar contact formulation based on an extended finite element interpolation to capture physical pressure discontinuities at the contact boundary. The so called two-half-pass algorithm is employed, which leads to an
De Lorenzis, Laura   +2 more
core   +1 more source

Self‐Soldering, Stretchable and Self‐Healing Liquid Metal Elastomer Interconnections for Soft Electronics Platforms

open access: yesAdvanced Materials Technologies, EarlyView.
A self‐healing and electrically conductive liquid metal elastomer enables robust self‐soldering of surface mount devices for soft electronics. Photothermally activated conductive pathways, strong pressure‐sensitive adhesion, and stable package‐integrated contacts provide high conductivity and extreme stretchability.
Su Thiri San   +5 more
wiley   +1 more source

Isogeometric B\'ezier dual mortaring: Refineable higher-order spline dual bases and weakly continuous geometry

open access: yes, 2017
In this paper we develop the isogeometric B\'ezier dual mortar method. It is based on B\'ezier extraction and projection and is applicable to any spline space which can be represented in B\'ezier form (i.e., NURBS, T-splines, LR-splines, etc.).
Borden, M. J.   +5 more
core   +1 more source

In Situ X‐Ray Tomography and Acoustic Emission Monitoring of Damage Evolution in C/C‐SiC Composites Fabricated by Liquid Silicon Infiltration

open access: yesAdvanced Science, EarlyView.
This study investigates how the internal structure of fiber‐reinforced ceramic composites affects their resistance to damage. By combining 3D X‐ray imaging with acoustic emission monitoring during mechanical testing, it reveals how silicon distribution influences crack formation.
Yang Chen   +7 more
wiley   +1 more source

Analysis of porous and chemical additives effects on the cement-lime mortar properties

open access: yesTehnički Glasnik, 2017
Cement-lime (CL) mortar has a number of properties and most important property of this mortar type is dependent on the admixtures and aggregates. By varying the ratio of ingredients, the characteristics of CL mortar can be adapted to specific mortar ...
Khrystyna Moskalova   +2 more
doaj  

Ketahanan Mortar di Lingkungan Asam dengan Berbagai Tipe Semen [PDF]

open access: yes, 2014
This research study the compressive strength, porosity, weight changes, visual inspection and acidic penetration of mortar OPC cement, mortar PCC cement, and mortar with made by combine of OPC+10% Palm Oil Fuel Ash (POFA).
Hutapea, U. (Uliarta)   +2 more
core  

Mortar

open access: yesProceedings of the 28th Asia and South Pacific Design Automation Conference, 2023
Yunhung Gao   +4 more
openaire   +1 more source

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