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Numerical analysis on MUF process for flip chip packaging
2014 15th International Conference on Electronic Packaging Technology, 2014With merits like high I/O density, superior electrical and thermal performance, and small form factor, flip chip has become more and more widely used in electronic packages. Although the flip chip packaging process has been fairly improved, the conventional CUF (Capillary Underfill) process is a bottleneck that results in lower productivity and higher ...
Xiyun Cheng +5 more
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Molding Recipe Study for MUF Solder Crack Improvement
International Symposium on Microelectronics, 2018Abstract In recent years, flip chip technology becomes more and more important with benefits of thin package profile, reduction of package outline, and excellent electrical and thermal performance by connection of copper pillar bumps (CuP) or C4 solder bumps.
Scott Chen +5 more
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[Device increasing the capabilities of the MUF-5 microspectrophotometer].
Tsitologiia, 1975Technical data for coordination of the device electric scheme and the MUPH-5 scheme (both with and without the integrator MIU-2) are presented together with a following computer analysis. The device enables to record discrete changes of optical density on the scanning pathway thus giving an advantage in application for quantitative analysis of ...
Iu K, Makarov, V A, Prianishnikov
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BONDING PERFORMANCE OF MUF AND PUR ADHESIVES FOR GLUED LAMINATED TIMBER
World Conference on Timber Engineering 2025Bibliografija: str. 3583.
Šernek, Milan +2 more
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MUF Calculations Including the Effect of the Earth's Magnetic Field
Radio Science, 1968To investigate the influence of the earth's magnetic field on ionospheric propagation, P'(f) curves were calculated by means of a ray‐tracing program. The calculations were made for a path length of 2000 km. The geomagnetic latitude of the midpoint of the path and the angle between the magnetic meridian and the path are varied in steps of 15 ...
Helmut Kopka, Hans G. Möller
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The Significance of Sporadic E Propagation in Determining the MUF
1968This paper deals with two aspects of sporadic E propagation. One concerns the application of sporadic E tabulated data to propagation studies while the other refers to the significance of sporadic E propagation for paths in excess of 2000 kms.
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An F1 layer MUF prediction system for Northern latitudes
IEEE Transactions on Antennas and Propagation, 1965Ionospheric propagation via the F1 layer is important for transmission distances in the 2000-3400 km range. Existing prediction systems yield large discrepancies between the predicted and observed F1 layer maximum usable frequencies (MUFs). An improved F1 layer prediction system has been developed which can be used for predicting the F1 layer MUF for ...
L. Petrie, E. Stevens
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Transmission Loss for Ionospheric Propagation Above the Standard MUF
Radio Science, 1966Transmission loss for ionospheric propagation over a 4000‐km path from Maryland to Southern California has been measured experimentally at several frequencies in the HF band. The observed losses were in close agreement with those predicted at all frequencies near and below the st~dard maximum usable frequency (MUF).
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