Results 181 to 190 of about 24,496 (231)

MUF Technology Development for SiP Module

ECS Transactions, 2011
In this study, we developed the molded underfill (MUF) technology for system in package (SiP) module with fine pitch flip chip in RF application, in which two flip chips, LC filter, and additional passive components are integrated side-by-side. This study covered not only MUF reliability performance but also MUF design study focused on minimizing voids
YoungDo Kweon, Job Ha, KiChan Kim, MinSeok Jang, JaeCheon Doh, ChangBae Lee, Dojae Yoo   +6 more
openaire   +1 more source

MOF/MUF behavior over one European path

Acta Geophysica, 2007
Many applications of HF propagation via the ionosphere (e.g. bearing-fingers, single station location, emergency systems and so on) demand an accurate description of ionospheric conditions. The International Reference Ionosphere (IRI) model is very often used for such a description. A lot of publications were devoted to the verification and improvement
Olga A. Maltseva, B. G. Barabashov, V. T. Rodionova, A. S. Shlyupkin   +3 more
openaire   +1 more source

Enhanced bonding of acetylated wood with an MUF-based adhesive and a resorcinol-formaldehyde-based primer

, 2019
Acetylated wood is a durable and dimensionally stable product with many potential applications in exterior timber structures. Research has shown that acetylated wood can be effectively bonded by various adhesive types.
A. Treu, Ronny Bredesen, F. Bongers
semanticscholar   +1 more source

Mechanism of Moldable Underfill (MUF) Process for RDL-1^st Fan-Out Panel Level Packaging (FOPLP)

Electronic Components and Technology Conference, 2019
In order to achieve higher productivity and lower cost, Fan-out Panel Level Packaging (FOPLP) is being developed recently to increase throughput significantly compared to FOWLP.
L. Bu, F. Che, V. S. Rao, Xiaowu Zhang
semanticscholar   +1 more source

Molding Recipe Study for MUF Solder Crack Improvement

International Symposium on Microelectronics, 2018
Abstract In recent years, flip chip technology becomes more and more important with benefits of thin package profile, reduction of package outline, and excellent electrical and thermal performance by connection of copper pillar bumps (CuP) or C4 solder bumps.
Scott Chen, Leander Liang, Pallas Hsu, Tim Tsai, Mason Liang, Michael Shy   +5 more
openaire   +1 more source

Goofy Mus, Grumpy Mur and Dirty Muf

Proceedings of the 2014 Workshops on Advances in Computer Entertainment Conference, 2014
The article discusses the concept of MurMur Moderators, talking playful seats designed to facilitate playful atmosphere and creativity at office environments. The concept of MurMur Moderators consists of five different personalities, grumpy Mur, goofy Mus, mellow Muh, sensitive Mut and shy Mum. The article describes the experiences and reactions to two
Mayra Frans, Tyni Heikki, Alha Kati, Kultima Annakaisa, Nummenmaa Timo   +4 more
openaire   +1 more source

MUfs and MOFs and LUFs and LOFs

IEEE Antennas and Propagation Magazine, 1992
One purpose of this column, "Stand on Standards," is to discuss antenna and propagation terms of controversy, with a goal of soliciting comments for the Subcommittees on Definitions, which are working toward standardized definitions. As noted in my column on fading (in the August, 1992, issue of the Magazine), this can be rather dry and tedious work ...
openaire   +1 more source

Enhancing MUF particleboard adhesives performance by glutaraldehyde addition

European Journal of Wood and Wood Products, 2012
Addition of small proportions of glutaraldehyde to MUF resin solids does yield an improvement in both dry internal bond (IB) strength and IB strength after 2 h boiling of the panel, TMA analysis shows that maximum MOE is also increased when small proportions of glutaraldehyde are added.
Zhou, X., Pizzi, A., Du, G.
openaire   +1 more source

Soybean meal‐based adhesive enhanced by MUF resin

Journal of Applied Polymer Science, 2012
AbstractSoybean meal flour, polyethylene glycol (PEG), sodium hydroxide (NaOH), and a melamine‐urea‐formaldehyde (MUF) resin were used to formulate soybean meal/MUF resin adhesive. Effects of the adhesive components on the water resistance and formaldehyde emission were measured on three‐ply plywood.
Qiang Gao, Sheldon Q. Shi, Shifeng Zhang, Jianzhang Li, Xiaomei Wang, Wubin Ding, Kaiwen Liang, Jinwu Wang   +7 more
openaire   +1 more source

Colloidal aggregation of MUF polycondensation resins: Formulation influence and storage stability

Journal of Applied Polymer Science, 2003
AbstractColloidal particle formation followed by their clustering has been shown to be the normal way of ageing of aminoplastic resins, in particular melamine–urea–formaldehyde (MUF) resins. Ageing (or further advancement of the resin by other means such as longer condensation times) causes whitening of the resin.
Zanetti, Michela, Pizzi, Antonio
openaire   +3 more sources