Results 291 to 300 of about 2,154,008 (376)

Ka-band broadband high-gain circularly polarized antenna array with high cross-polarization discrimination. [PDF]

Sci Rep
Li C, Zhu Y, Zhou Y, Xu Y, Xie W.
europepmc   +1 more source

Nonmulberry Silk Fibroin Doping Boosts Charge Transfer and Charge Injection in Aligned Polypyrrole‐Silk Scaffolds for Low‐Voltage Neurostimulation

Advanced Materials Interfaces, EarlyView.
Conductive silk‐polypyrrole scaffolds couple redox stability with cell‐affinitive peptides present innately in an endogenous silk fibroin, enabling optimized electrical stimulation to drive neurite outgrowth. Findings establish electrochemical‐biological link for biomaterial design rules for smart nerve guidance conduits that can provide low voltage ...
Rajiv Borah, Joseph Christakiran Moses, Jnanendra Upadhyay, Jitu Mani Das, Michael G. Monaghan, Biman B. Mandal   +5 more
wiley   +1 more source

Capabilities of the 3D-MLSI software tool in superconducting neuron design. [PDF]

Beilstein J Nanotechnol
Tarasova IE, Shuravin NS, Karelina LN, Razorenov FA, Zhardetsky EN, Ionin AS, Khapaev MM, Bol'ginov VV.   +7 more
europepmc   +1 more source

Investigating the Structural Factors Influencing the Magnetic Interaction between Individual Copper Spins in the CuCu4 Metallacrown Complex, from Its Bulk Form to Its Adsorption on Au(111)

Advanced Materials Interfaces, EarlyView.
The Cu(II)[12‐MCCu(II)N(Shi)‐4] metallacrown complex (CuCu4) is studied to examine how geometric transformations affect magnetic coupling between copper spins by using ultraviolet photoemission spectroscopy and DFT calculations for the bulk phase and CuCu4 adsorbed on Au(111). While adsorption minimally affects tDOS, exchange coupling constants between
Ariyan Tavakoli, Stefan Lach, Frederik Pütz, Dominic Stephan, Anne Lüpke, Dominik Laible, Siegfried Kaidisch, Andreas Windischbacher, Eva Rentschler, Peter Puschnig, Hans‐Christian Schneider, Christiane Ziegler   +11 more
wiley   +1 more source

Mutual coupling reduction between dual polarized microstrip patch antennas using compact spiral artificial magnetic conductor

, 2011
Lila Mouffok, Lana Damaj, Xavier Begaud, Anne Claire Lepage, Hubert Diez   +4 more
openalex   +1 more source

Multimodal Imaging of Strain and Light Emission of Core–Shell InGaN/GaN Wires under a Sub‐Micrometer Polychromatic X‐Ray Probe

Advanced Materials Interfaces, EarlyView.
Micro‐Laue diffraction and excited optical X‐ray luminescence are used to study InGaN/GaN core‐shell wires on the BM32 beamline at the European Synchrotron. Multimodal imaging of X‐ray fluorescence, deviatoric strain tensors and optical emissions is performed using simultaneous mapping.
Beatriz de Goes Foschiani, Sergio Bongiorno, Odile Robach, Olivier Ulrich, Jean‐Sébastien Micha, Joël Eymery   +5 more
wiley   +1 more source

Design and fabrication of a slant polarized monopulse antenna array with a cosecant squared beam for tracking applications. [PDF]

Sci Rep
Razavi SMJ, Hamidi SM, Hamidi SA.
europepmc   +1 more source

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

Advanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz, Yaroslav Mudryk, Jun Cui, Lucas Griffith, Duane D. Johnson, Julie Slaughter   +5 more
wiley   +1 more source

Quantifying coupling and causality in dynamic bivariate systems: a unified framework for time-domain, spectral, and information-theoretic analysis. [PDF]

Front Netw Physiol
Sparacino L, Pinto H, Barà C, Antonacci Y, Pernice R, Rocha AP, Faes L.   +6 more
europepmc   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

Advanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal, Davey Boss, René H. Poelma, Elias Vlieg, John J. Schermer   +4 more
wiley   +1 more source