Enhanced Thermal Stability of Thermoplastic Polymer Nanostructures for Nanoimprint Lithography. [PDF]
Materials (Basel), 2019 Jiang Y, Luo B, Cheng X.
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Gold Nanopost-Shell Arrays Fabricated by Nanoimprint Lithography as a Flexible Plasmonic Sensing Platform. [PDF]
Nanomaterials (Basel), 2019 Farcau C +4 more
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Perfluoropolyether (PFPE) Intermediate Molds for High-Resolution Thermal Nanoimprint Lithography. [PDF]
Nanomaterials (Basel), 2018 Masciullo C +3 more
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Using Nanoimprint Lithography to Create Robust, Buoyant, Superhydrophobic PVB/SiO2 Coatings on wood Surfaces Inspired by Red roses petal. [PDF]
Sci Rep, 2019 Yang Y, He H, Li Y, Qiu J.
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Implementation of two distinct wavelengths to induce multistage polymerization in shape memory materials and nanoimprint lithography. [PDF]
Polymer (Guildf), 2018 Zhang X +5 more
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Nanoimprint lithography is profound!
Journal of the Japan Society for Precision Engineering, 2009 openaire +2 more sources
Thermal nanoimprint lithography for drift correction in super-resolution fluorescence microscopy. [PDF]
Opt Express, 2018 Youn Y, Ishitsuka Y, Jin C, Selvin PR.
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A modified squeeze equation for predicting the filling ratio of nanoimprint lithography. [PDF]
Nano Converg, 2017 Ryu J, Lee H, Lee SH, Lim H, Lee J.
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Athermal Azobenzene‐Based Nanoimprint Lithography
Advanced Materials, 2016A novel nanoimprint lithography technique based on the photofluidization effect of azobenzene materials is presented. The tunable process allows for imprinting under ambient conditions without crosslinking reactions, so that shrinkage of the resist is avoided. Patterning of surfaces in the regime from micrometers down to 100 nm is demonstrated.
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Electrochemical Nanoimprint Lithography
2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), 2021Electrochemical Nanoimprint Lithography (ECNL) works directly on semiconductor wafer, free of thermoplastic and photocuring resists, and without any auxiliary process. The principle of ECNL is the spatially confined electrochemical corrosion caused by the contact potential across the metal/semiconductor phase boundaries exposed to electrolyte solution.
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