Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source
Green analytical method for determination of oxeladin citrate using advanced electrochemical modified sensors in pure form, pharmaceuticals, human serum and binary mixtures with guaifenesin. [PDF]
Sci RepHammad SF, Hendawy HA, Habib HM.
europepmc +1 more source
Direct Ink Writing 3D Printing of Recyclable and Thermally Stable Vitrimers
Advanced Materials Technologies, EarlyView.Vitrimers hold great promise in additive manufacturing as defect‐insensitive, repairable, and recyclable feedstocks. A thin‐film additively manufactured process is developed for a high‐performance vitrimer that is difficult to process traditionally.
Louis O. Vaught +2 more
wiley +1 more source
Nonreciprocal plasmons in one-dimensional carbon nanostructures. [PDF]
Nat CommunRodríguez Echarri Á +2 more
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Advanced Materials Technologies, EarlyView.Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya +2 more
wiley +1 more source
Synthesis and Characterization of Nanostructured Thorium Carbide for Radioactive Ion Beam Production. [PDF]
Nanomaterials (Basel)Reis E +8 more
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Advanced Techniques for Scalable Woven E‐Textiles Manufacturing
Advanced Materials Technologies, EarlyView.This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin +2 more
wiley +1 more source
Unveiling the Unique Reinforcement Mechanisms of Coiled Carbon Nanotubes and Their Hydrogenated Counterparts in Asphalt Modification. [PDF]
Nanomaterials (Basel)Nie F, Lin H, Su X, Ou K, Chen Y.
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Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Advanced Materials Technologies, EarlyView.Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications
Advanced Materials Technologies, EarlyView.This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
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